Disk Device Side Film for PWB Dust and Outgassing Control
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Solution Overview
Problem
In disk devices like hard disk drives (HDDs) with internal spaces filled with gases other than air, such as helium, the exposed insulating parts of the printed wiring board (PWB) can lead to dust fallout and outgassing, causing contamination and potential noise interference.
Innovation Solution
A protective film is applied to the side surface of the PWB, comprising a metal plating and adhesive resin, which seals the penetration hole and covers the side surface, preventing dust fallout and outgassing while maintaining electrical connectivity and facilitating manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the insulating part of the PWB is exposed on the side surface, then electrical connectivity is maintained, but dust fallout and outgassing occur causing contamination
Solution Approach 1:
A protective film is applied to cover the exposed insulating part of the PWB side surface. The film acts as a barrier that prevents dust fallout and outgassing while maintaining the electrical functionality of the PWB, thus reducing contamination without significantly increasing device complexity
Solution Approach 2:
The protective film is formed as a composite structure with a resin layer and a metal plating layer. The resin layer provides baseline protection against dust and outgassing, while the metal plating layer enhances the protective effect and provides additional benefits such as improved surface properties and durability
2Reliability
If the internal space is filled with gas different from air, then performance is improved, but dust and outgas from PWB can contaminate the gas environment
Solution Approach 1:
The protective film covers the exposed insulating part of the PWB, creating a barrier that prevents outgassing from the PWB materials from contaminating the specialized gas environment (e.g., helium) in the internal space, thus maintaining gas environment integrity
Solution Approach 2:
The protective film creates a localized protective environment around the PWB, preventing interaction between the PWB materials and the inert gas atmosphere, thereby preventing contamination of the gas environment by outgassing products
3Object-affected harmful factors
If the side surface is covered with protective film, then contamination is suppressed, but manufacturing complexity increases
Solution Approach 1:
The protective film is applied to the PWB side surface during the manufacturing process, before final assembly. This preliminary protection prevents dust fallout during subsequent handling and assembly operations, and the film application is integrated into the existing manufacturing workflow
Solution Approach 2:
The protective film uses a composite structure with resin and metal plating layers that can be applied using established manufacturing techniques. The resin layer provides the base protection while the metal plating can be applied through conventional plating processes, maintaining ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective film effectively suppresses contamination and noise interference, enhancing manufacturing efficiency and maintaining the internal gas environment's integrity by preventing dust and outgas release from the PWB's side surface.
Implementation Method 1
a protective film is applied to the side surface, comprising a metal plating and adhesive resin
Data Source
AI summary
A disk device according to an embodiment includes a housing, a magnetic disk, a printed wiring board, and a film. The housing is provided with an internal space filled with gas different from air and a penetration hole that makes the internal space communicate with an outside. The magnetic disk is disposed in the internal space. The printed wiring board includes a first surface attached to the housing, a second surface located opposite to the first surface, and a side surface provided between an outer edge of the first surface and an outer edge of the second surface. The printed wiring board is configured to seal the penetration hole. The film covers the side surface.