Disk Drive Actuator Mounting with Localized Conductive Paste
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Solution Overview
Problem
The existing actuator mounting sections in disk drive suspensions face challenges in achieving reliable electrical conduction at the bridge junction between the actuator element and the conductive plate while minimizing the use of expensive conductive paste, as the electrical resistance often exceeds tolerance due to shrinkage and low wettability with insulating resin bonding materials.
Innovation Solution
An actuator mounting section with a specific configuration of electrically conductive paste, comprising a first portion on the resin bonding material, a second portion on the conductive plate, and a third portion on the electrode, applied using a paste application device that adjusts air pressure based on elapsed time to maintain target height and width, ensuring reliable electrical conduction while reducing paste usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amount of conductive paste is increased to reduce electrical resistance, then electrical conduction is improved, but the cost increases due to the expensive silver paste
Solution Approach 1:
The patent applies different paste heights at different locations: a first paste height on the insulating resin bonding material and a second paste height on the conductive plate, where the second paste height is greater than the first. This local differentiation ensures adequate electrical conduction on the conductive plate while minimizing paste usage on the insulating material where it is less effective.
Solution Approach 2:
The patent controls the vertical dimension (paste height) differently across the bridge junction area. By setting specific paste heights relative to the bridge junction surface and controlling the thickness of conductive paste on the insulating resin, the patent optimizes electrical conduction in the vertical dimension while reducing overall material consumption.
2Quantity of substance
If the conductive paste is applied thinly to minimize usage, then cost is reduced, but electrical resistance exceeds tolerance due to shrinkage and low wettability
Solution Approach 1:
The patent specifies that the conductive paste on the insulating resin bonding material should have a controlled thickness (first paste height) that is optimized for that specific substrate. The paste height on the insulating resin is kept smaller than on the conductive plate, creating local quality differences that prevent shrinkage-related failures while minimizing overall paste usage.
Solution Approach 2:
The patent establishes predetermined paste height specifications before the actual paste application process. By defining the first paste height on the insulating resin and the second paste height on the conductive plate in advance, the patent prevents shrinkage and wettability issues before they occur, ensuring reliable electrical conduction without excessive paste usage.
3Reliability
If the paste height on insulating resin is increased to improve conduction, then electrical resistance is reduced, but paste usage and cost increase
Solution Approach 1:
The patent creates a differentiated paste height structure where the paste on the insulating resin bonding material has a first height that is smaller than the second height on the conductive plate. This local quality differentiation ensures that electrical conduction requirements are met at the conductive plate interface while minimizing paste consumption on the insulating material.
Solution Approach 2:
The patent applies conductive paste selectively with different heights in different areas rather than uniformly across the entire bridge junction. By applying paste to a lesser extent on the insulating resin compared to the conductive plate, the patent achieves adequate electrical conduction with partial action, avoiding excessive paste usage on areas where it is less effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for reliable electrical conduction at the bridge junction while minimizing the use of conductive paste, maintaining electrical resistance within tolerance and reducing costs.
Implementation Method 1
The piezoelectric material is in the form of a plate, and one electrode is provided on one thicknesswise surface thereof, and the other electrode on the other surface
Implementation Method 2
The one electrode is electrically connected to an electrically conductive plate on the ground side through a bridge junction of an electrically conductive paste, such as silver paste
Data Source
AI summary
Actuator elements are accommodated in openings formed in a conductive plate. These actuator elements are secured to the conductive plate by a resin bonding material. An electrode of each actuator element and the conductive plate are electrically connected to each other by a bridge junction consisting of an conductive paste. A paste application device discharges the conductive paste toward the bridge junction by air. A control unit configured to control the discharge of the conductive paste sets the air pressure according to the elapsed time of use of the conductive paste so that the height of the paste above the resin bonding material is not less than a target height. The target height is maintained by increasing the air pressure with increase of the elapsed time of use of the conductive paste.