Disk Drive Hermetic Seal Using Solder Preform and Channel
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Solution Overview
Problem
Existing disk drive sealing methods make re-work difficult as they require unsealing the drive, which can lead to heat-related damage and increased complexity.
Innovation Solution
A method involving a solder preform seal between the top cover and base of a disk drive enclosure, where a solder channel is formed in the top cover and the solder preform is aligned with it, allowing for hermetic sealing without welding or melting the components, using a laser to re-flow the solder for sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional welding or melting methods are used to seal the disk drive, then hermetic sealing is achieved, but re-work becomes difficult and heat-related damage occurs
Solution Approach 1:
The sealing structure is segmented into three distinct components: a solder preform (sealing material), a solder channel (containing structure in the top cover), and a solder barrier (sealing structure in the base). This segmentation allows the seal to be formed without melting the cover or base, enabling easier re-work while maintaining hermetic sealing.
Solution Approach 2:
A solder preform is introduced as an intermediary material between the top cover and base. This solder preform melts at a lower temperature than the cover or base materials, creating a hermetic seal without requiring the cover or base to be melted or welded, thus preserving component integrity and enabling easier re-work.
2Reliability
If conventional welding methods are used to seal the disk drive, then hermetic sealing is achieved, but higher temperatures cause heat-related damage to components
Solution Approach 1:
The sealing process uses localized heating applied only to the solder preform within the solder channel, rather than heating the entire top cover or base. This localized approach achieves hermetic sealing while minimizing heat exposure to other components, preventing heat-related damage.
Solution Approach 2:
The invention changes the temperature parameter by using a solder preform with a melting point significantly lower than that of the top cover or base materials. This allows the sealing process to occur at lower temperatures (typically 180-250°C for solder) compared to conventional welding methods, preventing heat-related damage to sensitive components.
3Reliability
If the disk drive is sealed using traditional methods, then hermetic sealing is achieved, but the sealing process becomes more complex
Solution Approach 1:
The solder preform, solder channel, and solder barrier are prepared in advance during the assembly process. The solder preform is positioned in the solder channel, and the top cover is placed on the base with the solder barrier in position before sealing. This preliminary preparation simplifies the actual sealing process and reduces overall complexity.
Solution Approach 2:
The invention replaces complex mechanical welding systems with a simpler thermal process. Instead of using high-energy welding equipment to melt and fuse the cover and base, the process uses controlled heating to melt the solder preform, which then flows to create the hermetic seal. This substitution significantly reduces process complexity and equipment requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy re-opening of the disk drive for maintenance while maintaining a hermetic seal, reducing heat-related damage and requiring lower temperatures than conventional welding, thus preserving component integrity.
Implementation Method 1
using a laser to re-flow the solder for sealing
Implementation Method 2
re-flow the solder for sealing
Implementation Method 3
forming a solder channel within a top cover of a disk drive enclosure and disposing a solder preform on a base of the disk drive enclosure such that the solder preform aligns with the solder channel
Data Source
AI summary
A method for forming a seal for hermetically sealing a hard disk drive assembly. The method includes forming a solder channel within a top cover of a disk drive enclosure and disposing a solder preform on a base of the disk drive enclosure such that the solder preform aligns with the solder channel when the top cover is positioned on the base.