Disk Drive Suspension Conductive Plate Gold Plating
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Solution Overview
Problem
Existing disk drive suspensions face issues with unreliable electrical conduction between the conductive resin and the conductive plate member, particularly in hot humid environments, due to high electrical resistance and conduction failure, which can be exacerbated by poor adhesion of gold plating and increased peel strength issues.
Innovation Solution
A thin porous gold plating layer of 100 nm or less is applied to the conductive plate member, enhancing adhesion and securing the conductive resin, while allowing for reliable electrical connection and improved durability without welding failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick gold plating layer is applied to the conductive plate member, then electrical conduction is improved, but adhesion to conductive resin deteriorates
Solution Approach 1:
The patent applies a thin gold plating layer (100 nm or less) specifically to the current-carrying part of the conductive plate member where electrical contact is needed, rather than thick plating across the entire surface. This localized thin plating maintains electrical conductivity while preserving adhesion properties where the conductive resin contacts the plate member.
Solution Approach 2:
The patent changes the thickness parameter of the gold plating layer from conventional thick plating to an ultra-thin layer of 100 nm or less. This parameter change transforms the plating from an oxidization-resistant barrier that prevents adhesion into a conductive enhancement that maintains both electrical performance and mechanical bonding.
2Strength
If conventional conductive resin is applied without gold plating, then adhesion is maintained, but electrical resistance increases in hot humid environments
Solution Approach 1:
The patent creates a composite structure combining ultra-thin gold plating (100 nm or less) with conductive resin on the conductive plate member. The gold layer provides oxidation resistance and electrical conductivity enhancement, while the conductive resin maintains adhesion and mechanical bonding, achieving synergistic performance in both electrical and mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable and reliable electrical conduction between the conductive plate member and the microactuator element, maintaining low electrical resistance and high peel strength even in hot humid conditions, comparable to gold-plated areas, thus enhancing the durability and performance of the disk drive suspension.
Implementation Method 1
a thin porous plating layer of thickness 100 nm or less comprising a large number of gold particles and formed on at least a surface of the current-carrying part of the conductive plate member
Data Source
AI summary
A microactuator element as an example of an electrical component is disposed on a metallic, electrically conductive plate member. A conductive resin member is disposed on a current-carrying part of the conductive plate member and a conduction part of the microactuator element. A thin porous plating layer of thickness 100 nm or less includes a large number of gold particles is formed in a region of a surface of the conductive plate member which covers the current-carrying part. The conductive resin member is secured to the conductive plate member through the thin porous gold plating layer and electrically connected to the conductive plate member.