Disk Substrate Grinding with Synchronized Inner and Outer Feed
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Solution Overview
Problem
Existing grinding methods for disk-shaped substrates struggle to achieve high dimensional accuracy and concentricity between the inner and outer circumferences, leading to suboptimal results due to differences in grinding conditions, load, and velocity between the two areas.
Innovation Solution
A grinding method where the inner and outer circumference grinding devices are fed radially towards each other, then stopped simultaneously while the substrate continues to rotate, allowing for continuous grinding and finishing processes with dedicated rough and finishing surfaces on the grinding stones, ensuring synchronized completion and maintaining dimensional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If inner and outer circumferences are ground simultaneously with different grinding conditions, then productivity is improved, but manufacturing precision deteriorates due to differences in load, velocity, and grinding content
Solution Approach 1:
The patent applies parameter changes by adjusting the rotational speeds of the inner and outer circumference grinding stones to match the linear velocities at their respective contact points with the workpiece. By calculating and setting appropriate rotational speeds based on the radius and desired linear velocity, the patent ensures that both grinding operations proceed under comparable velocity conditions, thereby maintaining manufacturing precision while achieving simultaneous grinding of both circumferences
Solution Approach 2:
The patent implements dynamics by making the rotational speeds of the grinding stones adjustable and adaptable during the grinding process. The system dynamically adjusts the rotational velocities of the inner and outer circumference grinding stones to compensate for differences in radius and loading conditions, ensuring optimal grinding performance and precision throughout the operation
2Productivity
If grinding stones are subjected to different loads during simultaneous grinding, then productivity is maintained, but reliability deteriorates due to uneven wear and inconsistent grinding quality
Solution Approach 1:
The patent changes operational parameters by adjusting the rotational speeds of the grinding stones to account for differences in load conditions. By modifying the rotational velocity parameter based on the specific load each grinding stone experiences, the patent ensures that both inner and outer circumference grinding operations maintain consistent cutting conditions, leading to uniform wear and reliable grinding quality throughout the process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances concentricity and dimensional accuracy of both inner and outer circumferences, reduces processing time, and maintains high precision even as grinding stones wear, by synchronizing the completion of both grinding processes and allowing for effective spark-out periods.
Implementation Method 1
grinding an inner circumference of the disk-shaped substrate while an inner circumference grinding device is fed in a radial direction toward an outer circumference of the disk-shaped substrate and grinding the outer circumference of the disk-shaped substrate while an outer circumference grinding device is fed in the radial direction toward the inner circumference of the disk-shaped substrate
Data Source
AI summary
The grinding method of a disk-shaped substrate that grinds a disk-shaped substrate including a portion having a hole at the center thereof while rotating the disk-shaped substrate is provided with: grinding an inner circumference of the disk-shaped substrate while an inner circumference grinding device is fed in a radial direction toward an outer circumference of the disk-shaped substrate and grinding the outer circumference of the disk-shaped substrate while an outer circumference grinding device is fed in the radial direction toward the inner circumference of the disk-shaped substrate; and stopping the feedings of the inner circumference grinding device and the outer circumference grinding device at the same time.