Disk Substrate Inner Polishing Tension and Segmented Support
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Solution Overview
Problem
Conventional methods for polishing the inner circumference of disk-shaped substrates with central opening holes face challenges such as uneven polishing, rotation swing, and polishing liquid flow into mechanical parts, leading to reduced apparatus life and instability in processing small diameters.
Innovation Solution
A method involving a brush with a flexible shaft core, fixed at both ends to rotating shafts with tension applied, and a second brush with shorter, harder bristles for precise polishing, along with a substrate holder design that includes a gear system and polishing liquid flow-in openings for uniform liquid distribution, prevents swing and abrasion, ensuring even and precise polishing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a brush shaft is supported at one end only, then the structure is simple, but the unsupported side swings largely causing uneven polishing
Solution Approach 1:
The brush shaft support structure is segmented into multiple support points along the shaft length. Instead of a single support, multiple supports are distributed to reduce the span between support points, thereby reducing swing and improving polishing uniformity while maintaining structural simplicity.
Solution Approach 2:
The brush shaft is pre-positioned and secured at multiple points before the polishing operation begins. This preliminary positioning ensures the shaft maintains proper alignment and minimal swing throughout the polishing process, preventing uneven polishing from the outset.
2Adaptability or versatility
If brush shaft diameter is reduced for small diameter disks, then adaptability to small substrates is improved, but shaft rigidity decreases causing increased swing
Solution Approach 1:
The shaft support system is segmented into multiple close-spaced support points. This segmentation allows the use of thinner, more flexible shafts for small substrate processing while the multiple supports prevent excessive deflection and swing, maintaining both adaptability and structural integrity.
Solution Approach 2:
The problem is solved by transitioning from a single-dimension solution (shaft diameter) to a multi-dimensional solution. Instead of only changing shaft diameter, the support structure is optimized in multiple dimensions (number of supports, spacing, positioning) to maintain rigidity while allowing thin shafts for small substrates.
3Manufacturing precision
If polishing liquid is supplied to inner circumference, then polishing effectiveness is improved, but liquid flows into mechanical parts causing abrasion and reduced apparatus life
Solution Approach 1:
The harmful element (polishing liquid) is extracted or excluded from the mechanical parts through protective measures. Seals, shields, or directed flow paths are implemented to prevent polishing liquid from reaching bearings and other mechanical components, thereby preventing abrasion and extending apparatus life while maintaining effective polishing liquid supply to the workpiece.
Solution Approach 2:
An intermediary protective barrier is introduced between the polishing liquid and mechanical parts. This intermediary element (such as a seal or protective coating) allows the polishing liquid to perform its function on the workpiece while blocking its path to the mechanical components, preventing harmful contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves precise and even inner circumference polishing, reduces rotation swing, and prevents polishing liquid from entering mechanical parts, thereby extending apparatus life and improving processing accuracy, especially for substrates with small diameters.
Implementation Method 1
a brush having a shaft core is inserted into the portion having an opening hole of the disk-shaped substrate; at least any one of one end and the other end of the brush is pulled, and tension is applied in an axial direction to the shaft core of the brush; and the brush is rotated, and the inner circumference of the disk-shaped substrate is polished
Data Source
AI summary
The disk-shaped substrate inner circumference polishing method for polishing an inner circumference of a disk-shaped substrate including a portion having an opening hole at the center thereof includes inserting a brush having a shaft core into the portion having the opening hole of the disk-shaped substrate; fixing one end and the other end of the brush to a pair of rotating shafts that are provided at mutually detached positions and pulling at least any one of the one end and the other end of the brush and applying tension in the axial direction to the shaft core of the brush; and rotating the brush and polishing the inner circumference of the disk-shaped substrate.