Disk Susceptor Radial Notches Thermal Stress Relaxation

The susceptor is divided into multiple independent susceptor units, each capable of supporting substrates. These segmented units can be independently heated and cooled, reducing thermal stress concentration and preventing cracking while maintaining the ability to process multiple substrates simultaneously.

Multiple susceptor units are arranged in a nested configuration within the processing chamber, allowing efficient space utilization for processing multiple substrates while each unit maintains its own thermal management characteristics, reducing overall thermal stress.

Different regions of the susceptor structure are assigned different thermal properties. The lower surface is designed for efficient heat input while the upper surface and side walls incorporate thermal management features that promote uniform temperature distribution, reducing thermal gradients and stress.

The heating approach is extended from one-dimensional (lower surface only) to multi-dimensional thermal management, incorporating heating and cooling capabilities at multiple locations and orientations of the susceptor structure to achieve uniform temperature distribution.

The complex rotating and revolving motion is achieved through multiple simpler susceptor units, each with simpler geometry. This segmentation reduces manufacturing complexity and cost for each unit while the collective arrangement achieves the desired thin film uniformity through coordinated motion.

Multiple susceptor units are combined in a coordinated system where their individual simpler motions merge to achieve the complex orbital and rotational patterns needed for uniform thin film deposition, reducing the complexity of individual components.