Disk Drive Suspension Microactuator Mounting Pit Design
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Solution Overview
Problem
Conventional dual-stage-actuator (DSA) suspensions in hard disk drives face conduction failures due to trapped air bubbles in conductive resin, leading to incomplete adhesion and potential gaps at the junction between the conductive plate member and microactuator element, especially in humid environments.
Innovation Solution
The DSA suspension design incorporates a pit formed in the conductive plate member to house the conductive resin, with a cover layer and an undercoat layer to prevent air bubble ingress, ensuring reliable conduction by securing the conductive resin within the pit and stabilizing its electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive resin is introduced to the junction of the conductive plate member, then electrical connection is established, but air bubbles are trapped causing conduction failure
Solution Approach 1:
A pit is formed in the conductive plate member at the junction location before introducing the conductive resin. This preliminary structural preparation creates a dedicated cavity that guides the resin flow and prevents air bubble entrapment during the bonding process, ensuring complete adhesion between the microactuator element and conductive plate member.
Solution Approach 2:
The pit acts as an intermediary structure between the conductive plate member and the microactuator element. It serves as a controlled interface that facilitates complete resin infiltration and bonding while eliminating air bubbles, thereby ensuring reliable electrical conduction without direct contact between the harmful factor (air bubbles) and the junction.
2Strength
If conductive resin is used to connect the microactuator element and conductive plate member, then electrical connection is achieved, but adhesion is incomplete due to air bubbles
Solution Approach 1:
The pit is formed in advance in the conductive plate member to create a controlled bonding interface. This preliminary action ensures that when conductive resin is introduced, it can fully infiltrate the junction area without air bubble interference, achieving complete adhesion between the microactuator element and conductive plate member, which in turn ensures reliable electrical conduction.
3Ease of manufacture
If simple introduction of conductive resin is used, then manufacturing process is simple, but conduction failure occurs in humid atmosphere
Solution Approach 1:
The pit formation is integrated into the manufacturing process as a preliminary step before resin application. While this adds one manufacturing step, it significantly improves conduction reliability in humid conditions by preventing air bubble entrapment and ensuring complete adhesion, thereby eliminating the need for complex additional processes or rework.
Solution Approach 2:
The invention changes the geometric parameter of the junction interface by introducing a pit structure. This parameter change modifies the resin flow characteristics and bonding interface, ensuring complete wetting and adhesion even in challenging environmental conditions like high humidity, thereby preventing conduction failure without complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances conduction reliability between the conductive plate member and microactuator element, preventing conduction failures and maintaining the flexibility of hinge portions, thus ensuring accurate and stable positioning of the magnetic head.
Implementation Method 1
An electrically conductive resin member for electrically connecting the microactuator element and the conductive plate member is disposed in a region covering the junction
Implementation Method 2
The microactuator comprises a piezoelectric element of lead zirconate titanate (PZT) or the like. The microactuator element serves to move the distal end of the suspension finely in a sway direction (or transversely relative to tracks) at high speed
Data Source
AI summary
An element accommodation portion is formed in an electrically conductive plate member which constitutes a part of a suspension. A microactuator element comprising a piezoelectric element is located in the element accommodation portion. An electrically conductive resin member is disposed in a region covering junctions for electrically connecting the conductive plate member and the microactuator element. A pit is formed in the junction of the conductive plate member by partial-etching. A part of the conductive resin member is in the pit. A part of an outer peripheral edge of the conductive resin member is located inside an edge of the pit. The conductive resin member is covered by a cover layer.