Dismantlable Interposer Structure for Protecting Semiconductor Pads
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Solution Overview
Problem
Existing semiconductor device packaging configurations face challenges in accommodating sophisticated features while minimizing performance impact and costs, leading to potential damage or contamination of sensitive features during handling and packaging.
Innovation Solution
A dismantlable structure formed from a rigid non-conductive material with a first region temporarily protecting features and a second region surrounding it, connected by segments that can be severed to reveal underlying features, providing structural support and protection during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a traditional fixed packaging structure is used, then structural support is provided, but sensitive features may be damaged or contaminated during handling and packaging
Solution Approach 1:
The packaging structure is divided into a first region and a second region separated by gaps, with the first region configured to be removed. This segmentation allows the protective packaging to be divided into removable and permanent portions, enabling feature protection during manufacturing while avoiding contamination or damage to sensitive areas.
Solution Approach 2:
The packaging structure is designed with the first region positioned to protect sensitive features before they are exposed. The structure is prepared in advance with the removable first region already in place, providing preliminary protection during handling and packaging operations before the features need to be accessed.
2Ease of manufacture
If features are exposed during manufacturing, then subsequent packaging steps can be performed, but features may be damaged or contaminated during handling
Solution Approach 1:
The packaging structure is segmented into a removable first region and a permanent second region. This allows the first region to be removed to expose features for subsequent packaging steps, while the second region remains to provide ongoing protection and structural support.
Solution Approach 2:
The packaging structure transitions from a static protective covering to a dynamic system where the first region can be removed while the second region remains. This dynamic configuration allows the structure to adapt between providing protection and allowing access to features during different manufacturing stages.
3Object-affected harmful factors
If a protective structure is added, then features are protected from damage and contamination, but device complexity increases
Solution Approach 1:
The protective packaging structure is divided into two regions separated by gaps, with the first region configured to be removed. This segmentation provides targeted protection where needed while allowing for easy removal to expose features, reducing overall complexity compared to a fully enclosed permanent structure.
Solution Approach 2:
The first region of the packaging structure is designed to be removed after serving its protective function. This temporary protective element is discarded after completing its purpose, allowing features to be exposed for subsequent steps without the burden of a permanent complex protective structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dismantlable structure effectively protects semiconductor device features from damage and contamination, allowing pristine feature exposure post-manufacturing by removing the first region, thus maintaining structural integrity and performance.
Implementation Method 1
The second region is attached to the top side of the packaged semiconductor die by way of an adhesive disposed along an outer perimeter
Implementation Method 2
The connecting segments are configured to be severed (e.g., by way of laser ablation) to completely separate the first region from the attached second region
Data Source
AI summary
A semiconductor device having dismantlable structure is provided. The method includes forming a packaged semiconductor die by mounting the semiconductor die onto a package substrate in a flip chip orientation, attaching an interposer substrate over a backside of the semiconductor die, and encapsulating with an encapsulant the semiconductor die and remaining gap region between the package substrate and the interposer substrate. A bond pad of the semiconductor die is interconnected with a conductive trace of the package substrate. The interposer substrate includes a plurality of conductive pads exposed at a top surface and interconnected with the package substrate. A dismantlable structure is attached on the top surface of the interposer substrate. A first region of the dismantlable structure covers the plurality of conductive pads.