3D Printing Dispensing Device Localized Heating
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Solution Overview
Problem
Conventional FDM methods face issues with inadequate bonding between deposited materials, thermal stress, and material sticking to the dispensing head, leading to suboptimal 3-D printing results.
Innovation Solution
A dispensing device with a localized heating device that includes a main body heater and a peripheral heating path surrounding the head portion, allowing independent control of heating energy to maintain the material and deposition area at optimal temperatures for bonding, preventing sticking, and achieving strong bonds in 3-D printed objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional FDM heating method is used, then the structure is simple, but the bonding strength between deposited materials is insufficient
Solution Approach 1:
The heating system is divided into two independent segments: a main body heater for heating the material reservoir and a localized heating device for heating the deposition region. This segmentation allows each heater to be optimized for its specific function, improving bonding strength without requiring a completely complex system architecture.
Solution Approach 2:
The localized heating device applies heat specifically to the deposition region where material bonding occurs, rather than heating the entire dispensing device uniformly. This localized approach concentrates thermal energy where it is most needed for bonding, improving strength without proportionally increasing overall system complexity.
2Stress or pressure
If conventional FDM heating method is used, then the equipment cost is low, but thermal stress remains in the printed object
Solution Approach 1:
The localized heating device provides controlled heating only to the deposition region, creating a localized thermal field that minimizes temperature gradients across the entire printed object. This reduces thermal stress while the independent control allows optimization of heating parameters.
Solution Approach 2:
The localized heating device pre-heats the deposition region before material deposition occurs, ensuring the substrate is at the optimal temperature for bonding. This preliminary heating action prevents thermal shock and reduces thermal stress in the final printed object.
3Object-generated harmful factors
If conventional FDM heating method is used, then the system is simple to operate, but material sticks to the dispensing head passage
Solution Approach 1:
The localized heating device creates a specific thermal environment around the dispensing head that maintains material temperature without excessive heat. This localized control prevents material from overheating and sticking to the passage walls, while the rest of the system remains relatively simple.
Solution Approach 2:
The heating system provides dynamic temperature control with independent adjustment of the main body heater and localized heating device. This dynamic control allows optimization of material flow properties to prevent sticking while maintaining operational simplicity through programmable temperature profiles.
4Temperature
If conventional FDM heating method is used, then energy consumption is low, but bonding temperature control is insufficient
Solution Approach 1:
The localized heating device concentrates energy only where it is needed for bonding, rather than heating large volumes of material or the entire dispensing device. This improves temperature control precision while minimizing overall energy consumption by eliminating unnecessary heating zones.
Solution Approach 2:
The divided heating system allows independent control of heating zones, enabling energy to be applied only when and where bonding is occurring. This segmentation improves temperature control precision while the ability to independently control each heater optimizes energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures strong bonding and reduced thermal stress in 3-D printed objects while minimizing equipment costs and energy consumption by providing localized heating, allowing for flexible temperature control and easy adaptation to different dispensing devices.
Implementation Method 1
a main body heater for heating the material in at least a section of the passage to a flowable condition
Implementation Method 2
the heating device includes a peripheral path surrounding the head portion and heats a region surrounded by the peripheral path
Implementation Method 3
the material may stick to the passage of the dispense head and thus hinder the feeding or discharging of the material
Data Source
AI summary
The present disclosure provides a dispensing device and a 3-D printing apparatus including the same. The dispensing device comprises a main body with a main body heater, a head portion and a heating device. The main body includes a passage with a longitudinal axis and the main body heater is used for heating the material in at least a section of the passage to a flowable condition. The head portion is connected to an end of the passage and communicates with the passage and further includes an outlet for discharging the heated material. The heating device includes a peripheral path surrounding the head portion and heats a region surrounded by the peripheral path.