Liquid Dispensing Head Thermal Management via U-Shaped Pressing Member
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Solution Overview
Problem
In typical liquid discharge heads, a pressing member without a predetermined shape hinders the close contact between the driver IC and the heat dissipation plate, leading to inadequate heat dissipation during the operation of piezoelectric elements.
Innovation Solution
A liquid discharge head design featuring a U-shaped pressing member with an elastic member and a housing that includes protruding portions to securely fix the heat dissipation plate, ensuring the driver IC is pressed firmly against the heat dissipation plate, even if the pressing member does not have a predetermined shape, and utilizing thermal conductive materials for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a pressing member without a predetermined shape is used, then the device complexity is reduced, but the driver IC cannot be sufficiently pressed against the heat dissipation plate, resulting in poor heat dissipation
Solution Approach 1:
The pressing member is pre-formed with a predetermined shape (protruding portion and pressing surface) before assembly, enabling it to automatically and uniformly press the driver IC against the heat dissipation plate without requiring additional adjustment or complex assembly steps
Solution Approach 2:
The pressing member's geometry is specifically designed with controlled parameters including protrusion height (0.5-2mm), pressing surface area, and elastic modulus selection, transforming a simple component into an effective heat dissipation solution through parameter optimization
2Ease of manufacture
If the pressing member is simplified without predetermined shape, then manufacturing is easier, but the structural support and positioning of the driver IC deteriorates
Solution Approach 1:
The pressing member is pre-formed with a predetermined shape (protruding portion and pressing surface) before assembly, enabling it to automatically and uniformly press the driver IC against the heat dissipation plate without requiring additional adjustment or complex assembly steps
Solution Approach 2:
The pressing member's geometry is specifically designed with controlled parameters including protrusion height (0.5-2mm), pressing surface area, and elastic modulus selection, transforming a simple component into an effective heat dissipation solution through parameter optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively brings the driver IC into close contact with the heat dissipation plate, ensuring efficient heat dissipation and improving the structural support of the pressing member within the liquid discharge head.
Implementation Method 1
a heat dissipation plate 50...configured to dissipate heat generated by the driver IC 33
Implementation Method 2
a pressing member 34 configured to press the driver IC 33 toward the heat dissipation plate 50 from a back side of the driver IC 33
Data Source
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AI summary
A liquid discharge head (8) includes a head body (20), a driver IC (33), a housing (40), a heat dissipation plate (50), and a pressing member (34). The head body (20) includes a discharge hole (63) configured to discharge a liquid. The driver IC (33) controls driving of the head body (20). The housing (40) is located on the head body (20), and includes an opening at a side surface. The heat dissipation plate (50) is located at the opening of the housing (40), and is configured to dissipate heat generated by the driver IC (33). The pressing member (34) presses the driver IC (33) against the heat dissipation plate (50). In addition, the heat dissipation plate (50) is fixed to the pressing member (34).