Dispensing Head Rotational Orientation for Bonding Thickness
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Solution Overview
Problem
Current dispensing systems for applying bonding materials to carrier substrates suffer from imprecise application, particularly in terms of varying thickness, making them unsuitable for high-volume production.
Innovation Solution
A dispensing system with a dispensing head that can be moved translationally and rotationally in three-dimensional and two-dimensional manners, respectively, using spatial information to orient and position the dispensing head for precise application of bonding material along a bonding surface, ensuring a consistent thickness and homogeneous distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional dispensing system is used to apply bonding material to a carrier substrate, then the bonding material can be applied, but the thickness varies and the distribution is non-homogeneous
Solution Approach 1:
The dispensing head is made dynamically adjustable through rotational movement around the carrier substrate, allowing real-time adaptation to the bonding surface geometry. This dynamic positioning enables the dispensing slit to maintain optimal orientation and distance throughout the bonding material application process, ensuring consistent thickness and homogeneous distribution across irregularly shaped substrates
Solution Approach 2:
The system introduces rotational movement in addition to translational movement, adding a third dimension of control to the dispensing process. This rotational degree of freedom allows the dispensing head to orient itself relative to the carrier substrate, enabling precise control over bonding material flow direction and distribution patterns
2Manufacturing precision
If the dispensing head is fixed in position and orientation, then the system is simple, but the bonding material application is imprecise on irregularly shaped substrates
Solution Approach 1:
The dispensing head incorporates rotational joints that enable dynamic repositioning during operation. These rotational degrees of freedom allow the dispensing slit to adapt its orientation relative to the carrier substrate, maintaining precise bonding material application even on irregularly shaped surfaces while managing system complexity through controlled mobility
3Manufacturing precision
If the dispensing slit is oriented randomly, then the setup is simple, but the bonding material distribution is non-homogeneous
Solution Approach 1:
The dispensing head is equipped with rotational capability that allows it to dynamically orient the dispensing slit relative to the carrier substrate during operation. This dynamic orientation adjustment ensures the dispensing slit maintains the optimal angle and position for homogeneous bonding material distribution across the bonding surface, eliminating the need for complex pre-positioning procedures
Data Source
Figure 1(a)~2
Figure 3(a)~3(b)
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AI summary
The invention relates to a method (1) for applying a bonding material (6) to a bonding surface (7) of a carrier substrate (8) by means of a dispensing system (9), to the dispensing system (9) and to a dispensing head (13) of the dispensing system (9).