Shared Dispensing and Stamping Table for Multi-Chip Adhesive Bonding
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Solution Overview
Problem
Conventional multi-chip bonding processes are not space and cost-efficient due to the need for separate dispensing and stamping devices with additional transfer time required for switching between them during the bonding process, especially when handling semiconductor chips of different sizes.
Innovation Solution
An integrated apparatus with a common positioning table for both dispensing and stamping devices, equipped with a switching member that moves the stamping device to different standby positions, allowing for efficient application of adhesive fluid on various chip sizes without the need for separate positioning tables and optical systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate dispensing and stamping devices are used for different die sizes, then bonding reliability is improved, but apparatus complexity and space requirements increase
Solution Approach 1:
The patent combines both dispensing and stamping devices onto a single shared positioning table, merging two separate systems into one integrated apparatus. This reduces the number of separate positioning tables and optical systems needed, thereby decreasing apparatus complexity while maintaining the ability to handle different die sizes reliably
Solution Approach 2:
The shared positioning table is designed to support both dispensing and stamping operations, making it a multi-functional platform. This universal table can accommodate different die sizes and bonding approaches without requiring separate dedicated tables for each function
2Reliability
If separate dispensing and stamping devices are used, then bonding reliability is improved, but manufacturing cost increases
Solution Approach 1:
By merging dispensing and stamping devices onto one positioning table and sharing optical systems, the patent reduces the total number of components needed, thereby lowering manufacturing costs while preserving bonding reliability for different die sizes
3Reliability
If separate dispensing and stamping devices are used, then bonding reliability is improved, but transfer time between devices increases
Solution Approach 1:
The patent eliminates the need to transfer chips between separate positioning tables by combining both dispensing and stamping devices on a single shared table, thereby reducing transfer time while maintaining bonding reliability
Solution Approach 2:
The shared positioning table is prepared in advance to accommodate both dispensing and stamping operations, allowing seamless switching between modes without requiring intermediate transfer steps, thus reducing cycle time
4Manufacturing precision
If dispensing device with small nozzle is used for large dies, then adhesive application is improved, but nozzle clogging risk increases
Solution Approach 1:
The patent enables dynamic switching between dispensing and stamping modes on the shared positioning table, allowing the system to adapt the adhesive application method to the specific die size and requirements, thereby optimizing precision while managing nozzle clogging risks through method selection rather than fixed nozzle size
Data Source
Figure 1~2A
Figure 2B~3A
Figure 3B~3C
AI summary
An apparatus for applying an adhesive fluid onto a bonding surface during a bonding process includes a positioning table, a dispensing device, a stamping device and a switching member which are mounted on the positioning table. The dispensing device is configured to be positionable by the positioning table to dispense the adhesive fluid onto the bonding surface. The stamping device is configured to be positionable by the positioning table to stamp the adhesive fluid onto the bonding surface. The dispensing device and stamping device are operative to apply the adhesive fluid onto different bonding positions on the bonding surface. The switching member coupled to the stamping device is configured to move the stamping device to a first standby position when the dispensing device is dispensing the adhesive fluid and to a second standby position when the stamping device is stamping the adhesive fluid.