Dispersion-Liquid Bonding Composition for Low-Temperature Joining
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Solution Overview
Problem
Conventional joint materials for high-temperature applications, such as solder and anisotropically conductive adhesives, face challenges in achieving high joint strength at low joining temperatures without pressure, while maintaining thermal resistance and preventing resin decomposition, and there is a need for lead-free alternatives due to environmental concerns.
Innovation Solution
A dispersion-liquid bonding composition containing inorganic metallic colloidal particles with nanometer-size particles coated with unsaturated carboxylic acid and amines with 4 to 7 carbon atoms, which lowers the melting point and enhances dispersibility, allowing for pressureless joining at low temperatures and improving thermal and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder is used for high-temperature joining, then joint strength is improved, but joining temperature must be increased to melting point or higher
Solution Approach 1:
The invention changes the physical and chemical parameters of the joint material by using nanometer-size inorganic metallic particles (1-100 nm) instead of conventional solder. The nanoscale dimension causes melting point depression, allowing the material to remain solid at lower temperatures during joining while maintaining metal-like bonding characteristics. This enables joining at temperatures significantly below the conventional melting point of bulk metal solder.
Solution Approach 2:
The invention creates a composite material system combining inorganic metallic nanoparticles with organic components (resin, dispersant, curing agent). The inorganic metallic particles provide metal-like bonding and electrical conductivity, while the organic matrix enables low-temperature curing and processability. This composite approach allows the material to exhibit properties of both metal and polymer, achieving strong joints at low temperatures without requiring melting.
2Strength
If conventional metallic nanoparticle composition is used, then joining is achieved, but pressure application and inert atmosphere are required
Solution Approach 1:
The invention modifies the chemical composition parameters by incorporating specific organic components (resin, dispersant, curing agent) that enable the material to cure at low temperatures through chemical reactions. This chemical curing mechanism replaces the need for pressure and inert atmosphere, allowing joining to proceed under atmospheric conditions without external pressure application.
Solution Approach 2:
The organic components act as intermediaries that facilitate bonding between inorganic metallic particles and substrates. The resin matrix and curing agent create chemical bonds that hold the nanoparticles together and to the substrates, eliminating the need for mechanical pressure. The dispersant serves as an intermediary that ensures uniform distribution of particles, enabling effective bonding without complex processing conditions.
3Temperature
If resin component is used in conductive adhesive, then low-temperature joining is achieved, but resin decomposition occurs at high operating temperatures
Solution Approach 1:
The invention creates a composite where inorganic metallic nanoparticles are embedded in an organic resin matrix. The inorganic metallic particles provide thermal stability and metal-like bonding characteristics that resist decomposition at high temperatures, while the resin matrix enables low-temperature processing. The synergistic combination allows the material to cure at low temperatures and maintain stability at high operating temperatures, overcoming the limitations of pure resin-based adhesives.
Solution Approach 2:
The invention applies local quality by having inorganic metallic particles concentrated at the bonding interfaces and within the joint structure, providing localized thermal resistance and structural integrity. The organic resin provides low-temperature processability in the bulk matrix. This spatial distribution of properties allows the material to exhibit both low-temperature curability and high-temperature stability in different regions of the joint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high joint strength and thermal resistance at low joining temperatures without pressure, with ricinoleic acid accelerating the fusion of inorganic metallic particles and forming a dense, conductive layer that maintains strength even when exposed to higher operating temperatures.
Implementation Method 1
Inorganic metallic colloidal particles with nanometer-size particles coated with unsaturated carboxylic acid and amines with 4 to 7 carbon atoms, which lowers the melting point
Implementation Method 2
ricinoleic acid accelerating the fusion of inorganic metallic particles and forming a dense, conductive layer
Implementation Method 3
improving thermal and electrical conductivity
Implementation Method 4
improving thermal and electrical conductivity
Data Source
AI summary
To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles. A bonding composition containing inorganic metallic particles and organic components including unsaturated hydrocarbon and amine with 4 to 7 of carbon number