Individually-Displaceable Bond Arms for Parallel Device Transfer
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Solution Overview
Problem
The throughput of electronic device processing is limited by the distances over which devices need to be transferred and the speed of the bond head mechanism, which is restricted by hardware limitations such as encoder performance and linear motion guide rigidity.
Innovation Solution
A method and apparatus using a bond head mechanism with individually-displaceable bond arms, allowing each bond arm to be actuated independently to pick up and place electronic devices, thereby increasing the number of devices that can be transferred and processed simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the bond head moving speed is increased to improve throughput, then productivity increases, but hardware limitations such as encoder performance and linear motion guide rigidity prevent further speed increases, and component lifetime decreases
Solution Approach 1:
The bond head is divided into multiple independently actuated bond arms (first bond arm, second bond arm, etc.), each capable of picking up electronic devices separately. This segmentation allows parallel operation where multiple devices can be picked up simultaneously by different bond arms, increasing throughput without requiring the entire bond head to move at higher speeds, thus avoiding the reliability issues associated with high-speed motion components.
2Productivity
If the pick-to-bond distance is reduced to improve throughput, then transfer distance decreases and productivity increases, but interference between ejector, wafer table and work holder occurs
Solution Approach 1:
Multiple bond arms are arranged in different spatial positions and dimensions within the bond head structure. This dimensional arrangement allows devices to be picked up from different locations and transferred to different bonding positions simultaneously, effectively utilizing three-dimensional space to overcome the layout constraints and interference issues that would occur with simple two-dimensional distance reduction.
3Quantity of substance
If a single bond arm picks up multiple electronic devices sequentially, then the number of devices transferred increases, but the time required for sequential pickup increases
Solution Approach 1:
The bond head is segmented into multiple bond arms that can operate independently and simultaneously. Instead of one bond arm sequentially picking up multiple devices (which would take time), multiple bond arms can pick up multiple devices at the same time, converting a sequential process into a parallel process and significantly reducing the total pickup time while increasing the number of devices transferred.
Data Source
AI summary
A method of transferring a plurality of electronic devices with a bond head mechanism having a bond head having a plurality of individually-displaceable bond arms includes the steps of: in a pickup operation, moving the bond head mechanism to position a first bond arm of the bond head mechanism over a first electronic device from a group of electronic devices from a supply of electronic devices arranged in a pickup area, and actuating only the first bond arm to pick up the first electronic device from the group of electronic devices; and moving the bond head to position a second bond arm of the bond head over a second electronic device from the group of electronic devices, and actuating only the second bond arm of the bond head to pick up the second electronic device.