Displaceable Insert Member for Semiconductor Die Encapsulation
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Solution Overview
Problem
The semiconductor die encapsulation and carrier-mounting processes are limited by height variations in the surface of the semiconductor die, leading to inconsistent pressure application, which can damage the die or result in insufficient bonding and/or contact, and are further complicated by the need to maintain open areas or windows during encapsulation.
Innovation Solution
A method and apparatus that utilize displaceable insert members with adjustable force control, allowing precise regulation of pressure applied to semiconductor dies using fluid pressure and expandable arrangements, such as pistons or membranes, to ensure consistent pressure application regardless of die height or tilt, and include a monitoring system to maintain a predetermined force, even when encapsulation material is introduced.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a member is brought into contact with the semiconductor die to create open windows in the encapsulation, then the encapsulation process can accommodate dies with height variations, but the pressure exerted by the insert member becomes inconsistent, causing either die damage or insufficient bonding
Solution Approach 1:
The insert member is made displaceable rather than fixed, allowing it to dynamically adjust its position and applied pressure in response to variations in die height and tilt. This dynamic adjustment capability enables consistent pressure application across dies with different dimensions while maintaining the ability to create open windows for encapsulation.
Solution Approach 2:
A monitoring system is implemented to detect the actual pressure or position of the insert member on the die surface, and this information is fed back to a control system that adjusts the insert member's displacement accordingly. This closed-loop feedback mechanism ensures consistent pressure application despite variations in die geometry.
2Manufacturing precision
If the insert member is made displaceable to adjust for die height variations, then pressure consistency can be improved, but the device complexity increases due to additional monitoring and control systems
Solution Approach 1:
The insert member is designed with self-adjusting capabilities through spring loading or fluid pressure mechanisms that automatically compensate for die height variations without requiring complex external control systems. The system uses the physical properties of springs or fluids to provide the necessary displacement and pressure regulation inherently.
Solution Approach 2:
Fluid pressure is utilized to control the displacement of the insert member, providing a simple yet effective means of adjusting pressure application. By regulating fluid pressure, the system can accommodate die variations without complex mechanical control mechanisms, reducing overall device complexity while maintaining precision.
3Force
If the insert member is wider than the die to provide stable contact, then the contact area is increased, but encapsulation material can come under the insert member and exert counteracting force, further limiting the process window
Solution Approach 1:
The insert member is divided into multiple separate contact points or zones rather than a single wide contact surface. This segmentation allows each segment to independently adapt to the die surface while preventing encapsulation material from accumulating under the entire insert member, reducing counteracting forces and expanding the process window.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a wider process window by ensuring consistent pressure application across semiconductor dies with varying heights and tilts, reducing the risk of damage and improving bonding quality while maintaining clean exposure areas and accommodating high-tolerance height variations, thereby enhancing the reliability and efficiency of the encapsulation process.
Implementation Method 1
utilize displaceable insert members with adjustable force control, allowing precise regulation of pressure applied to semiconductor dies using fluid pressure
Implementation Method 2
expandable arrangements, such as pistons or membranes, to ensure consistent pressure application
Data Source
Figure 1~2b
Figure 3
Figure 4a~4c
AI summary
A semiconductor die encapsulation or carrier-mounting method comprises the steps of providing a first tool part for holding multiple semiconductor dies and providing the semiconductor dies on the first tool part; providing a second tool part, one of the first and second tool parts comprising displaceable insert members to allow applying a pressure by each displaceable insert member on a surface area of a semiconductor die; and bringing together the first and second tool parts such as to define a space between the first and second tool parts, the semiconductor products being arranged in the space. The displaceable insert members apply a pressure onto the surface area of the semiconductor dies. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure. Subsequently, the first and second tool parts are separated and the processed semiconductor dies are removed.