Displaceable Insulation Barrier for PCB Packing Density
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Solution Overview
Problem
Existing circuit boards face challenges in achieving high packing density of electrical components when dealing with different electrical potentials, as they require larger air and creepage distances for double insulation, leading to increased space requirements and lower packing density.
Innovation Solution
A displaceable insulation barrier is introduced between electrical potentials on the circuit board, which can be inserted through an opening to increase air and creepage distances, allowing for sufficient insulation even with different voltage levels, thereby maintaining high packing density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If larger air and creepage distances are designed for double insulation between different potentials, then insulation coordination is improved, but space requirement increases and packing density decreases
Solution Approach 1:
The insulation barrier is divided into multiple segments that can be independently positioned along the circuit board. Each segment provides insulation between specific high-voltage and low-voltage areas, allowing the insulation distance to be increased only where needed rather than across the entire board, thus maintaining high packing density while ensuring adequate insulation coordination.
Solution Approach 2:
The insulating barrier acts as an intermediary element inserted between electrical components with different potentials. This mediator physically increases the air and creepage distances between high-voltage and low-voltage areas, providing the required double insulation without expanding the overall space requirement of the circuit board.
2Reliability
If a displaceable insulation barrier is inserted between electrical potentials, then insulation distance is increased, but device complexity increases
Solution Approach 1:
The insulation barrier is designed to be displaceable rather than fixed, allowing it to be moved to different positions along the circuit board. This dynamic capability enables flexible adaptation to different insulation requirements without redesigning the entire arrangement, and the barrier can be easily installed or repositioned using simple guide elements and engagement features.
Solution Approach 2:
The insulation barrier incorporates guide elements and engagement features that enable it to self-align and self-position correctly on the circuit board. The barrier automatically engages with corresponding features on the board, eliminating the need for complex external positioning mechanisms or precise manual alignment, thus reducing overall device complexity.
Data Source
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AI summary
The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board (2), said arrangement comprising said printed circuit board (2) and an insulation barrier (3), wherein the printed circuit board (2) has an opening (7) between the electric potentials, and the insulation barrier (3) is arranged displaceably through the opening (7) on the printed circuit board (2) in such a way that the insulation section between the two electric potentials can be enlarged by displacing the insulation barrier (3) in relation to the printed circuit board (2). The arrangement enables a high packing density on the printed circuit board (2).