Displaced Edge Coupler Layout for Low-Loss Hybrid Silicon Lasers
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Solution Overview
Problem
Existing silicon photonic technologies face design limitations in outcoupling light from silicon-based light sources, particularly due to thermal limitations and optical performance constraints related to edge coupling.
Innovation Solution
The proposed solution involves integrating a light source, such as a hybrid silicon laser, close to the semiconductor substrate for heat sinking, while using a dual dielectric waveguide structure with an edge coupler located farther from the substrate to achieve low-loss, large-mode-field-diameter edge coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the light source is placed close to the semiconductor substrate for heat sinking, then thermal dissipation is improved, but optical coupling performance deteriorates due to substrate leakage loss
Solution Approach 1:
A suspended substrate structure acts as an intermediary between the light source and the semiconductor substrate. The substrate is suspended at a distance (e.g., 5-20 micrometers) using support structures, creating an optical cavity that reduces substrate leakage loss while maintaining thermal contact for heat dissipation. This mediator structure allows simultaneous optimization of both thermal and optical performance.
2Loss of energy
If an edge coupler with large mode field diameter is used to reduce coupling loss, then optical coupling efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent transitions from planar integration to three-dimensional suspended architecture. By elevating the substrate and creating vertical optical cavities, the system achieves large mode field diameters at the edge coupler without increasing lateral device footprint. This dimensional change enables low-loss coupling while maintaining compact device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat dissipation and reduces substrate leakage loss, resulting in improved optical performance and power efficiency with lower coupling losses to external optics.
Implementation Method 1
the first dielectric waveguide overlapping at least a portion of the light source with respect to the lamination axis such that light is adiabatically coupled from the light source into the first dielectric waveguide
Implementation Method 2
the second dielectric waveguide comprising an edge coupler configured to couple light out of the second dielectric waveguide in a longitudinal direction perpendicular to the lamination axis
Data Source
AI summary
A device includes a semiconductor substrate, a light source displaced from the semiconductor substrate by a first displacement, a first dielectric waveguide displaced from the semiconductor substrate by a second displacement, and a second dielectric waveguide displaced from the semiconductor substrate by a third displacement. The second displacement is greater than the first displacement. The first dielectric waveguide overlaps at least a portion of the light source such that light is adiabatically coupled from the light source into the first dielectric waveguide. The third displacement is greater than the second displacement. The second dielectric waveguide overlaps at least a portion of the first dielectric waveguide such that light is coupled from the first dielectric waveguide into the second dielectric waveguide. The second dielectric waveguide includes an edge coupler configured to couple light out of the second dielectric waveguide.