Display Layer Structure for Adhesion Without Transmission Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display devices with a laminated structure of polyimide and inorganic films often experience weak adhesive strength, leading to film lifting phenomena, which deteriorates the reliability of the display.
Innovation Solution
A display device structure featuring a substrate with distinct areas, including a transmission area and a non-transmission area, where an amorphous silicon layer is positioned under an inorganic layer and a conductive layer, with specific openings to enhance adhesive strength and prevent ghost images, and a manufacturing method using halftone masks to pattern these layers efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a laminated structure of polyimide and inorganic film is used, then the display device can be manufactured with standard processes, but the adhesive strength between layers is weak causing film lifting
Solution Approach 1:
The patent applies different materials to different regions: amorphous silicon is deposited only in the non-transmission area where strong adhesion is needed, while the transmission area maintains the standard polyimide-inorganic film structure for optical performance. This local differentiation resolves the contradiction by providing enhanced adhesion where required without compromising manufacturability elsewhere.
Solution Approach 2:
The patent introduces a composite structure by combining amorphous silicon with the existing polyimide and inorganic film layers in the non-transmission area. This composite approach creates stronger interlayer bonding through the amorphous silicon layer, directly addressing the adhesive strength issue while maintaining compatibility with standard manufacturing processes.
2Reliability
If the amorphous silicon layer covers the entire substrate including transmission area, then adhesive strength is improved, but transmittance is reduced due to ghost images
Solution Approach 1:
The amorphous silicon layer is selectively deposited only in the non-transmission area where adhesion enhancement is needed, completely avoiding the transmission area. This spatially selective application ensures that transmittance is not compromised while still achieving the desired adhesive strength improvement in the appropriate region.
Solution Approach 2:
The substrate is divided into transmission and non-transmission areas with distinct layer structures. The amorphous silicon layer is segmented to exist only in the non-transmission area, creating a piecewise structure that optimizes both adhesion and optical performance in their respective zones.
3Illumination intensity
If multiple patterned openings are created in conductive and inorganic layers, then transmittance is maintained, but manufacturing complexity increases
Solution Approach 1:
The patent combines the formation of openings in the conductive layer, inorganic layer, and amorphous silicon layer into a single etching process using one photoresist pattern. This merging of multiple patterning steps into one operation maintains transmittance through the openings while significantly reducing manufacturing complexity compared to sequential patterning.
Solution Approach 2:
A photoresist layer is formed in advance with a predetermined pattern that defines all necessary openings before the etching process. This preliminary patterning action enables subsequent etching to create multiple openings simultaneously, maintaining transmittance while simplifying the manufacturing process by avoiding multiple separate patterning steps.
Data Source
AI summary
A display device is disclosed that includes a substrate, a display portion, a conductive layer, an inorganic layer, and an amorphous silicon layer. The substrate includes a first area including a transmission area and a non-transmission area adjacent to the transmission area, and a second area adjacent to the first area. The display portion is disposed in the non-transmission area and the second area on the substrate. The conductive layer is disposed between the substrate and the display portion, and overlaps the non-transmission area and the second area. The inorganic layer is disposed on the substrate under the conductive layer, in contact with the conductive layer, and overlaps the conductive layer. The amorphous silicon layer is disposed on the substrate, under the inorganic layer, in contact with the inorganic layer, overlaps the conductive layer in the first area, and entirely overlaps the substrate in the second area.