Display Module Adhesive Structure for Electrostatic Discharge
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Solution Overview
Problem
Existing display panels are susceptible to static electricity, leading to issues such as bright displays around the screen, abnormal screen displays, split screens, decreased sensitivity, and even failure, due to electrostatic charges entering the panel, which affect user experience and product yield.
Innovation Solution
A display module comprising a display panel, a flexible printed circuit, and a composite adhesive layer with through holes containing conductive structures, where the conductive structures are electrically connected to the flexible printed circuit, effectively directing static electricity away from the display area, thereby preventing it from entering the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional adhesive layer is used without through holes and conductive structures, then the display module has a simpler structure and easier fabrication, but static electricity enters the display area causing screen abnormalities and reduced reliability
Solution Approach 1:
The adhesive layer is segmented by creating through holes that penetrate it completely, dividing the adhesive layer into discrete sections while maintaining overall structural integrity. This segmentation allows conductive structures to be positioned strategically within the holes to provide electrostatic protection without requiring a complete redesign of the entire adhesive system.
Solution Approach 2:
Conductive structures are introduced as intermediary elements within the through holes of the adhesive layer. These conductive structures act as mediators that intercept and dissipate static electricity before it can reach the display area, while the adhesive layer itself serves as an intermediary bonding the flexible printed circuit to the display panel.
2Reliability
If conductive structures are added to the adhesive layer for electrostatic protection, then static electricity is effectively dissipated, but the fabrication process becomes more complex and time-consuming
Solution Approach 1:
Through holes are pre-formed in the adhesive layer before final assembly, and conductive structures are pre-positioned within these holes. This preliminary preparation allows for more controlled and precise fabrication, reducing the complexity of subsequent assembly steps and improving overall manufacturing efficiency despite the additional components.
Solution Approach 2:
Conductive structures are applied locally only where needed - specifically within the through holes of the adhesive layer - rather than requiring conductive treatment across the entire adhesive surface. This localized approach minimizes material usage and simplifies the fabrication process by focusing electrostatic protection only at critical entry points.
3Reliability
If the adhesive layer is made thicker to accommodate conductive structures, then electrostatic protection is improved, but the overall module width increases preventing narrow frame design
Solution Approach 1:
Instead of increasing the adhesive layer thickness in the vertical dimension to accommodate conductive structures, the solution utilizes the horizontal dimension by creating through holes and positioning conductive structures within them. This dimensional transition allows electrostatic protection functionality to be integrated without increasing the overall module width, enabling narrow frame design.
Solution Approach 2:
Conductive structures are nested within the through holes of the adhesive layer, with the conductive structures being contained inside the hollow spaces created by the holes. This nesting arrangement allows both the adhesive layer and conductive structures to coexist in a compact configuration that does not increase the overall module dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances user experience and extends the service life of the display module by preventing static-related issues while allowing for a narrow frame design without increasing thickness or width, and simplifies the manufacturing process, improving product yield.
Implementation Method 1
the conductive structure is electrically connected to the first conductive region... effectively prevent the static electricity from entering a display screen
Data Source
AI summary
A display module includes a display panel, a flexible printed circuit, a composite adhesive layer, and at least one conductive structure. The display panel includes a base substrate. The flexible printed circuit includes at least one first conductive region, and is electrically connected to the display panel. The composite adhesive layer is located at one side of the base substrate away from a light emission surface of the display panel. The composite adhesive layer includes at least one first through hole penetrating through the composite adhesive layer, and the conductive structure is at least partially located within the first through hole. Along a direction perpendicular to a plane where the base substrate is located, length of the composite adhesive layer is H1, and length of the conductive structure is H2, where H1≤H2. The conductive structure is electrically connected to the first conductive region.