Display Module Adhesive Heat Dissipation Path

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current display devices face challenges in effectively managing heat dissipation, which can lead to thermal issues and potential damage to components like the driving chip, due to inadequate heat radiation properties.

Innovation Solution

The display module incorporates a heat radiation member with high thermal conductivity (200 W/mK or higher), a driving chip mounted between the circuit board and the heat radiation member, and an adhesive member with a passage region to facilitate efficient heat dissipation, while also including a metal layer and anisotropic conductive films for electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional adhesive member is used to couple the circuit board to the display panel, then the assembly is simple and manufacturing is easy, but heat dissipation from the driving chip is insufficient leading to thermal damage

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidadhesive member structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The adhesive member is segmented into multiple functional layers: a first adhesive layer for coupling the circuit board to the display panel, and a second adhesive layer forming a heat dissipation path from the driving chip to the heat dissipation member. This segmentation allows the adhesive member to simultaneously provide both bonding and thermal management functions, resolving the contradiction between reliability improvement and device complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adhesive member is designed to perform multiple functions: mechanical bonding between components and heat dissipation from the driving chip. By integrating both adhesive and thermal management functions into a single component, the patent improves heat dissipation capability without proportionally increasing device complexity, as the same adhesive member structure serves dual purposes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If the driving chip is mounted directly on the circuit board, then the electrical connection is simple, but heat accumulates causing thermal damage to the driving chip

Engineering Contradiction:

Improvedriving chip thermal managementVSAvoidmounting structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A heat dissipation member is introduced as an intermediary component between the driving chip and the circuit board. The second adhesive layer creates a thermal pathway through this intermediary structure, allowing heat to be conducted away from the driving chip while maintaining the electrical connection through the circuit board. This intermediary heat dissipation member resolves the thermal management issue without significantly complicating the mounting structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If a heat radiation member with high thermal conductivity is added, then heat dissipation efficiency is improved, but the device structure becomes more complex

Engineering Contradiction:

Improveheat radiation efficiencyVSAvoidoverall device structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation member is merged with the existing adhesive member structure, combining thermal management functionality with the mechanical bonding function. The second adhesive layer is integrated into the adhesive member to create a continuous heat dissipation path from the driving chip through the adhesive member to the heat dissipation member. This merging approach improves heat radiation efficiency while minimizing the increase in overall device structure complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat radiation efficiency, preventing thermal damage to the driving chip and ensuring reliable operation by effectively dissipating heat generated within the display device.

Implementation Method 1

the heat radiation member may be on a lower surface of the lower member and may have a thermal conductivity of 200 W/mK or higher

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10905009B2Display module and display device including the same

Publication Date: 2021.01.26 SAMSUNG DISPLAY CO LTD

AI summary

A display device may include a heat radiation member on a lower surface of a display panel, a first circuit board overlapped with and electrically connected to a pad of the display panel and overlapped with the heat radiation member, a driving chip mounted on the first circuit board and located between the first circuit board and the heat radiation member, and an adhesive member coupling the first circuit board to the heat radiation member. When viewed in a plan view, the adhesive member may define an internal region in which the driving chip is located and a passage region connecting the internal region to an outer region of the adhesive member.