Display Substrate Adhesive Layout for Narrower Laser Cutting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing laser cutting methods for display substrate motherboards result in wide cutting line widths, which cannot meet the requirements for narrow frame designs due to the sensitivity of adhesive layers to heat and the subsequent wide influence of cutting light on film layers.
Innovation Solution
A display substrate motherboard design featuring a first adhesive layer, a second adhesive layer, and a first light blocking layer, where the first light blocking layer is configured to reflect or absorb cutting light, reducing its entry into the second adhesive layer, thereby controlling the cutting line width. The first light blocking layer can be a light reflecting or absorbing layer with an optically denser medium characteristic compared to the adhesive layers, and a second light blocking layer can be added between the second adhesive layer and the back film to further minimize light influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing laser cutting method is used, then cutting process is simple, but cutting line width is wide and cannot meet narrow frame requirements
Solution Approach 1:
The adhesive layer is segmented into a first adhesive layer and a second adhesive layer, separated by a light blocking layer. This segmentation allows the first adhesive layer to be cut by laser while the second adhesive layer is protected from heat and light, enabling narrow cutting line width without compromising adhesive performance.
Solution Approach 2:
A light blocking layer is introduced as an intermediary between the first adhesive layer and the second adhesive layer. This layer blocks heat and light from the laser cutting process, preventing them from reaching the second adhesive layer, thus enabling precise cutting while protecting the adhesive structure.
2Manufacturing precision
If laser cutting is applied to adhesive layer, then cutting is achieved, but heat and light affect the adhesive layers causing wide cutting line
Solution Approach 1:
The light blocking layer serves as a protective intermediary that absorbs or reflects heat and light from the laser cutting process, preventing these harmful factors from reaching the second adhesive layer. This enables precise cutting while eliminating the harmful thermal and optical effects on the adhesive structure.
Solution Approach 2:
By dividing the adhesive layer into two separate adhesive layers with the light blocking layer in between, the patent isolates the second adhesive layer from the heat and light generated during laser cutting of the first adhesive layer, thus reducing harmful effects while maintaining cutting precision.
3Manufacturing precision
If single adhesive layer is used, then structure is simple, but cutting light affects the entire adhesive layer causing wide frame
Solution Approach 1:
The adhesive layer is divided into a first adhesive layer and a second adhesive layer positioned at different locations. The first adhesive layer is located where cutting occurs, while the second adhesive layer is positioned away from the cutting zone, protected by the light blocking layer. This segmentation enables narrow frame width while maintaining adequate adhesive bonding.
Solution Approach 2:
The light blocking layer acts as a mediator that allows the cutting laser to pass through and cut the first adhesive layer while blocking the harmful heat and light from reaching the second adhesive layer. This enables precise cutting and narrow frame width without compromising the adhesive functionality of the second layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces the cutting line width of the display substrate motherboard, enabling the production of substrates with narrower frames by minimizing the heat and light impact on the adhesive layers during laser cutting.
Implementation Method 1
the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer
Implementation Method 2
The first light blocking layer can be a light reflecting or absorbing layer
Implementation Method 3
the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer. For example, the first light blocking layer is a first light reflecting layer, and the first light reflecting layer has an optically denser medium characteristic compared to the first adhesive layer and the second adhesive layer
Data Source
AI summary
Embodiments of the present disclosure provide a display substrate motherboard and a manufacturing method and a cutting method thereof, a display substrate and a display device. The display substrate motherboard includes a preset cutting position, a back film and an adhesive layer disposed on the back film, the adhesive layer includes: a first adhesive layer corresponding to the preset cutting position; a second adhesive layer disposed on two sides of the first adhesive layer in a direction parallel to the back film; and a first light blocking layer disposed between the first adhesive layer and the second adhesive layer, wherein the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer.