Display Module Adhesive Recess for Safe Carrier Panel Delamination

Solution Overview

Problem

Existing display panel manufacturing processes face challenges in ensuring process reliability and efficiency during the removal of carrier panels without causing damage to the display panels.

Innovation Solution

A display module design with a recessed adhesive layer and inclined lateral surfaces, facilitated by laser cutting and processing, allows for easy delamination of the carrier panel while exposing the display panel, thereby improving process reliability and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the adhesive layer is made flush with the carrier panel lateral surfaces for strong bonding, then bonding strength is improved, but carrier panel removal becomes difficult and may damage the display panel

Engineering Contradiction:

Improvebonding strengthVSAvoidcarrier panel removal ease

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The adhesive layer is prepared in advance with recessed lateral surfaces that extend beyond the carrier panel edges. This preliminary configuration allows the adhesive to be fully cured with optimal bonding strength while预先 providing exposed portions that will facilitate easy carrier panel removal later without damaging the display panel.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive layer is divided into two functional zones: a bonding zone that contacts both the display panel and carrier panel for strong adhesion, and exposed portions that extend beyond the carrier panel lateral surfaces. This segmentation allows the adhesive to simultaneously provide strong bonding and enable easy carrier removal.

Inventive Principle:

Principle #1Segmentation

2Ease of operation

If the adhesive layer extends beyond the carrier panel lateral surfaces to facilitate removal, then carrier panel removal ease is improved, but bonding strength may be reduced

Engineering Contradiction:

Improvecarrier panel removal easeVSAvoidbonding strength

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The adhesive layer is configured in advance with recessed lateral surfaces that extend beyond the carrier panel edges. This preliminary configuration allows the adhesive to be fully cured with optimal bonding strength while预先 providing exposed portions that will facilitate easy carrier panel removal later without damaging the display panel.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive layer is divided into two functional zones: a bonding zone that contacts both the display panel and carrier panel for strong adhesion, and exposed portions that extend beyond the carrier panel lateral surfaces. This segmentation allows the adhesive to simultaneously provide strong bonding and enable easy carrier removal.

Inventive Principle:

Principle #1Segmentation

3Productivity

If traditional laser cutting is used to remove the carrier panel, then cutting speed is improved, but the display panel may be damaged due to excessive laser intensity

Engineering Contradiction:

Improvecutting speedVSAvoiddisplay panel damage risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The adhesive layer is prepared in advance with recessed lateral surfaces that extend beyond the carrier panel edges. This preliminary configuration allows the adhesive to be fully cured with optimal bonding strength while预先 providing exposed portions that will facilitate easy carrier panel removal later without damaging the display panel.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive layer is divided into two functional zones: a bonding zone that contacts both the display panel and carrier panel for strong adhesion, and exposed portions that extend beyond the carrier panel lateral surfaces. This segmentation allows the adhesive to simultaneously provide strong bonding and enable easy carrier removal.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances process reliability and simplifies the manufacturing process by enabling efficient separation of the carrier panel without damaging the display panel, thus improving the overall manufacturing efficiency and reducing costs.

Implementation Method 1

processing the adhesive layer by emitting a second laser beam along a predetermined processing line defined on the insides of the first lateral surfaces such that a display module of the display apparatus is formed

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

emitting a second laser beam along a predetermined processing line defined on the insides of the first lateral surfaces such that a display module of the display apparatus is formed, wherein the second laser beam is emitted at an exposed lateral surfaces of the adhesive layer to generate a deformation area having a concave lateral surface by removing the deformation area from the cut adhesive layer

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentEP3739646B1Display module, display apparatus including the same, and method of manufacturing the display apparatus

Publication Date: 2025.12.03 SAMSUNG DISPLAY CO LTD

Figure 1A~1B
Figure 2A
Figure 2B

AI summary

A display module includes a display panel including a plurality of pixels, a carrier panel on a rear surface of the display panel, and an adhesive layer disposed between the display panel and the carrier panel, where the adhesive layer is in contact with the carrier panel. Lateral surfaces of the adhesive layer are recessed from lateral surfaces of the carrier panel.