Display Device Air Duct Plate Cooling
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Solution Overview
Problem
Existing display devices using light emitting elements face challenges in temperature distribution and cooling efficiency, leading to reduced reliability and uneven brightness, particularly due to the complexity and increased cost of ventilation systems and thermal resistance in current cooling solutions.
Innovation Solution
A display device design featuring a substrate with a light emitting element group and integrated circuits, an air duct plate on the backside, and a case body with openings for cooling air blown by a fan, allowing for localized and efficient cooling without excessive structural complexity or cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ventilation hole is formed to cool the display panel from front to back, then cooling capacity is improved, but manufacturing cost and structural complexity increase
Solution Approach 1:
The cooling system is segmented into distinct functional zones: a first cooling region for the display panel and a second cooling region for the substrate. This allows independent optimization of cooling paths for different components without requiring a single complex through-ventilation structure, thereby reducing overall structural complexity while maintaining effective cooling.
Solution Approach 2:
A cooling air passage is introduced as an intermediary structure that channels cooling air from the fan through the display panel to the substrate. This mediator component enables efficient heat transfer from the substrate to the external environment without requiring direct front-to-back ventilation holes in the display panel, thus simplifying the overall structure.
2Strength
If a mold member is disposed between LED mount substrate and cooling air, then structural support is provided, but thermal resistance increases and cooling efficiency decreases
Solution Approach 1:
The mold member is designed with differentiated thermal properties in different regions: a first region with high thermal conductivity for direct contact with the LED mount substrate to ensure efficient heat extraction, and a second region with lower thermal conductivity for structural support functions. This local differentiation allows the mold member to simultaneously provide mechanical strength and effective thermal conduction paths.
3Ease of manufacture
If integrated circuits are disposed on substrate avoiding LED elements, then circuit layout is simplified, but temperature distribution between LED elements becomes uneven
Solution Approach 1:
The cooling air passage is designed with non-uniform cross-sectional area along its length, creating variable cooling intensity at different positions. By optimizing the passage area at locations where integrated circuits are positioned, the system provides enhanced cooling to these heat-generating components without disrupting the simple layout of LED elements, thereby achieving uniform temperature distribution while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency and uniform temperature distribution, resulting in a reliable display with reduced brightness irregularities and color inconsistencies, achieved through a simpler and cost-effective design.
Implementation Method 1
a fan (5) that sends air into a space (12) surrounded by the case body (7) and the air duct plate (6), in which a plurality of openings (11) acting to blow the cooling air generated by the fan (5) to a predetermined portion on the side of the substrate (1) are formed in the air duct plate (6)
Data Source
AI summary
An air duct plate is provided on the back of a substrate on the surface of which a light emitting element group for display as well as an integrated circuit are disposed. A fan acts to send air into a space surrounded by a case body extending over and around the air duct plate and the air duct plate. A plurality of openings acting to blow a cooling air generated by the fan to a predetermined portion of the substrate are formed in the air duct plate.