Display Panel Layout With Air Gap for Driving Chip Heat Isolation
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Solution Overview
Problem
Existing display devices face challenges with heat dissipation due to the vertical overlap of driving chips and circuit boards, leading to thermal issues that affect performance.
Innovation Solution
A display device design that includes an air gap between the driving chip and the first circuit board, with the driving chip and first circuit board positioned above and below the display panel, respectively, to minimize thermal transfer and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the driving chip and circuit board are vertically overlapped to reduce device thickness, then the device structure is more compact, but heat dissipation performance deteriorates due to thermal transfer from the circuit board to the driving chip
Solution Approach 1:
The patent extracts the circuit board from the vertical overlap with the driving chip by positioning it in the peripheral area instead of directly beneath the driving chip. This separation removes the thermal interference pathway while preserving the compact form factor, as the circuit board is relocated to a position that does not compromise the overall device thickness.
Solution Approach 2:
The patent transitions from a vertical stacking arrangement (one-dimensional overlap) to a lateral distribution arrangement (two-dimensional separation). By positioning the circuit board in the peripheral area rather than vertically beneath the driving chip, the design utilizes the planar dimension to resolve thermal issues while maintaining compactness.
2Device complexity
If the driving chip is positioned to overlap the peripheral area for compact design, then device integration is improved, but thermal load on the driving chip increases due to proximity to the circuit board
Solution Approach 1:
The patent extracts the circuit board from the area directly beneath the driving chip by positioning it in the peripheral region. This spatial extraction eliminates the thermal load issue while preserving the integrated design, as the circuit board remains part of the compact structure but is relocated to a thermally favorable position.
3Stability of the object's composition
If the circuit board is positioned below the cover panel for structural stability, then mechanical support is improved, but heat transfer to the driving chip increases when vertically aligned
Solution Approach 1:
The patent introduces asymmetry in the vertical arrangement by positioning the circuit board in the peripheral area rather than centrally beneath the driving chip. This asymmetric positioning maintains structural stability through proper support placement while avoiding direct thermal alignment with the driving chip, thus resolving the heat transfer issue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air gap design effectively reduces thermal load on the driving chip, enhancing heat dissipation characteristics and improving overall device performance by minimizing heat transfer from the circuit board to the driving chip.
Implementation Method 1
an air gap, which overlaps the first portion in the first direction and overlaps the second portion in the second direction, may be provided between the cover panel and the second circuit board
Data Source
AI summary
A display device includes a display panel, a cover panel, a driving chip, a first circuit board, and a second circuit board. The driving chip may be on an upper surface of the display panel. The first circuit board may be on a lower surface of the cover panel. The first circuit board may include a first portion connected to the second circuit board and a second portion connected to a first end of the first portion. A first distance from a side surface of the cover panel to the first portion may be greater than a second distance from the side surface of the cover panel to the second portion. An air gap may be provided between the cover panel and the second circuit board. At least a part of the driving chip may overlap with the air gap in a plan view.