Display Panel Alignment Pad with Segmented Widths
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Solution Overview
Problem
Existing display devices face challenges in accurately determining the alignment between the pad portion and the integrated circuit chip, which complicates the manufacturing process and can lead to misalignment issues.
Innovation Solution
The display device incorporates a pad portion with specific design features, including alternating patterns of pads with varying widths and shapes, where the second pad has a width that includes the solder bump and twice a reference distance, allowing for easy alignment verification by positioning the solder bump within the pad's designated area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional pad structures are used, then the manufacturing process becomes complex and alignment verification is difficult, but the alignment between pad portion and integrated circuit chip cannot be accurately determined
Solution Approach 1:
The pad structure is segmented into multiple functional zones: a first pad for electrical connection, and a second pad with alternating wide and narrow portions for alignment verification. This segmentation allows the alignment function to be separated from the electrical connection function, enabling accurate alignment verification without complicating the overall device structure.
Solution Approach 2:
Different portions of the pad structure are given different local qualities: the first pad has standard dimensions for electrical connection, while the second pad features alternating wide and narrow portions with specific width ratios. This local differentiation enables the alignment verification function to be performed at specific locations without affecting the overall device complexity.
2Manufacturing precision
If alignment verification features are added to the pad structure, then alignment accuracy improves, but the manufacturing process becomes more complex
Solution Approach 1:
The alignment verification features are merged with the existing pad structure rather than being added as separate components. The second pad combines both the alignment verification function (through alternating wide and narrow portions) and the electrical connection function, allowing accurate alignment verification to be achieved without significantly complicating the manufacturing process.
Solution Approach 2:
The second pad is designed to serve multiple functions: it provides electrical connection like the first pad, and simultaneously serves as an alignment verification feature through its alternating wide and narrow portions. This multi-functionality allows alignment accuracy to be improved without adding separate alignment verification components that would complicate manufacturing.
3Ease of manufacture
If the pad structure is simplified for easy manufacturing, then manufacturing ease improves, but alignment verification capability is reduced
Solution Approach 1:
The pad structure is segmented into functional zones where the second pad contains alternating wide and narrow portions. This segmentation provides clear visual references for alignment verification while maintaining a relatively simple overall structure that is easy to manufacture using standard fabrication processes.
Solution Approach 2:
The second pad features asymmetric alternating wide and narrow portions with specific width ratios, creating an asymmetric pattern that is easily distinguishable for alignment verification. This asymmetric design provides clear alignment references without requiring complex symmetric structures, maintaining manufacturing simplicity while enabling alignment verification capability.
Data Source
AI summary
A display device includes a display area and a non-display area including a first driving pad portion at which a display panel is connected to an integrated circuit chip by a solder bump having a width. The first driving pad portion includes a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip, and a second pad by which alignment between the first driving pad portion and the integrated circuit chip is determined. The second pad of the first driving pad portion includes a (2-1)-th pad having a width which is the same as the width of the solder bump and a (2-2)-th pad having a width which is larger than the width of the (2-1)-th pad.