Display Antenna Feed Overlap for Narrow Bezels and Low Loss
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Solution Overview
Problem
Existing display devices face issues with wide bezels and high insertion loss due to the use of ACF adhesive for bonding the FPC and antenna, leading to uneven signal distribution and increased signal interference.
Innovation Solution
The antenna is partially disposed on the light emission surface, with a feed circuit board on the opposite side, and overlapping feed structures along the thickness direction to ensure coupling without ACF adhesive, maintaining uniform spacing and reducing heating requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ACF adhesive is used to bond FPC and antenna, then bonding is achieved, but bezel width increases and insertion loss increases
Solution Approach 1:
The patent transitions from planar bonding to three-dimensional overlapping configuration. The first feed structure and second feed structure are positioned on opposite sides of the display assembly and overlap along the thickness direction, enabling coupling through the display assembly without requiring lateral bezel space for bonding materials.
Solution Approach 2:
The patent removes the ACF adhesive bonding process entirely from the system. Instead of using adhesive to bond FPC and antenna laterally, the design uses direct electromagnetic coupling through the overlapping feed structures, eliminating the need for bonding materials and associated heating processes.
2Strength
If ACF adhesive is used to bond FPC and antenna, then bonding is achieved, but insertion loss increases
Solution Approach 1:
The patent removes the ACF adhesive bonding process entirely from the system. Instead of using adhesive to bond FPC and antenna laterally, the design uses direct electromagnetic coupling through the overlapping feed structures, eliminating the need for bonding materials and associated heating processes.
Solution Approach 2:
The patent replaces mechanical bonding (ACF adhesive with heating and pressing) with electromagnetic coupling. The overlapping feed structures transmit signals through electromagnetic fields through the display assembly, eliminating mechanical bonding processes that cause insertion loss.
3Ease of manufacture
If antenna is disposed on the back side of display assembly, then feed circuit board bonding is easier, but signal interference increases and radiation performance deteriorates
Solution Approach 1:
The patent transitions from planar bonding to three-dimensional overlapping configuration. The first feed structure and second feed structure are positioned on opposite sides of the display assembly and overlap along the thickness direction, enabling coupling through the display assembly without requiring lateral bezel space for bonding materials.
Data Source
AI summary
Provided are a display device and a manufacturing method thereof. The display device includes a display assembly, an antenna, and a feed circuit board. At least part of the antenna is disposed on the side of the light emission surface of the display assembly. The antenna includes a radiator and a first feed structure connected to the radiator. The feed circuit board is disposed on the side of the display assembly facing away from the light emission surface. The feed circuit board includes a power division network and a second feed structure connected to the power division network. The first feed structure at least partially overlaps the second feed structure along the thickness direction of the display assembly.