Display Control Assembly Heat Transfer Structure for Thermal Deformation
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Solution Overview
Problem
Thin display apparatuses face overheating issues due to heat generated by components, which can cause thermal deformation and degrade performance or lead to failure, as heat easily transfers between closely located components, and existing heat dissipation structures fail to maintain contact during thermal deformation.
Innovation Solution
A display apparatus structure with a heat transfer member made of high thermal conductivity material, including a separation member and coupling member to maintain contact between the heat transfer member and heating components, even during thermal deformation, ensuring efficient heat conduction to a back cover for dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the display apparatus is made thin to improve user convenience, then the overall thickness is reduced, but heat dissipation performance deteriorates due to close proximity of components causing heat transfer and overheating
Solution Approach 1:
A heat transfer member is introduced as an intermediary component between the heating component and the back cover. This mediator efficiently conducts heat away from the heating component through high thermal conductivity material, preventing heat accumulation and transfer to other components, thus resolving the overheating issue in thin display apparatuses
Solution Approach 2:
The thermal conductivity parameter of the heat transfer member is optimized to enhance heat dissipation efficiency. By selecting materials with high thermal conductivity and designing the heat transfer member with appropriate thickness and surface area, the heat dissipation performance is significantly improved while maintaining the thin overall structure
2Temperature
If a heat transfer member is used to improve heat dissipation, then heat transfer efficiency is enhanced, but thermal deformation causes separation between the heat transfer member and heating component, degrading heat dissipation performance
Solution Approach 1:
The mounting structure is designed to accommodate thermal expansion and deformation of components. By providing flexible mounting mechanisms and appropriate clearances, the structure maintains contact between the heat transfer member and heating component even when thermal deformation occurs, ensuring continuous heat dissipation
Solution Approach 2:
The mounting structure incorporates dynamic elements that can adapt to thermal deformation. The flexible mounting mechanism allows the heat transfer member to maintain contact with the heating component under varying thermal conditions, ensuring reliable heat transfer throughout operation
3Volume of moving object
If components are placed close together to reduce size, then the display apparatus becomes more compact, but heat easily transfers between components causing overheating
Solution Approach 1:
The heat transfer member acts as a thermal intermediary that directs heat flow away from other components. By positioning the heat transfer member between the heating component and other nearby components, it prevents harmful heat transfer to sensitive components while maintaining the compact overall size
Solution Approach 2:
The heat transfer member is strategically positioned and sized to provide localized heat management. By concentrating heat transfer capability at the critical interface between the heating component and other components, it effectively prevents heat transfer in specific problem areas while maintaining overall compactness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively prevents overheating by maintaining contact between the heat transfer member and heating components, enhancing heat dissipation efficiency and preventing operational failures.
Implementation Method 1
a heat transfer member made of a material having high thermal conductivity is in contact with other components so that heat generated from the heating components is easily transferred to the external atmosphere
Implementation Method 2
the outermost portion may serve as a heat sink to transfer heat to the atmosphere, thereby suppressing or addressing the overheating of the display apparatus
Data Source
AI summary
A display apparatus according to one example may include a display unit configured to display an image, a holder disposed above the display unit and provided in a plate shape, and a control assembly disposed above the holder and including a control board and a control chip mounted on an upper surface of the control board. The display apparatus may further include a separation member disposed between the holder and the control assembly to vertically separate the control assembly and the holder, a shield cover disposed to cover the control chip above the control assembly, and a coupling member for coupling the control board with the separation member. The separation member and the coupling member may be disposed at locations spaced apart from edges of the control board.