Display Back Plate Bonding Structure and Reflective Design
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Solution Overview
Problem
Current LED display panel manufacturing processes are complex due to the need for multiple inorganic insulating layers to prevent oxidation of bonding pads, leading to increased film layers and patterning processes, and result in low light-emitting brightness at front viewing angles due to large light-emitting angles of LED chips.
Innovation Solution
A drive back plate design where the bonding structure and target drive structure are on the same layer, with an inorganic insulating layer as the film layer, allowing for a one-time patterning process and reducing manufacturing complexity, and incorporating a reflective structure to enhance light utilization at front viewing angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple inorganic insulating layers are added to prevent oxidation of bonding pads, then oxidation protection is improved, but manufacturing complexity increases
Solution Approach 1:
The bonding pad structure is merged with the drive circuit structure by placing both on the same layer. The inorganic insulating layer that protects the bonding pad from oxidation is combined with the gate insulating layer of the drive circuit, eliminating the need for separate protective layers and reducing manufacturing complexity while maintaining oxidation protection
Solution Approach 2:
The inorganic insulating layer serves multiple functions simultaneously: it acts as the gate insulating layer for the drive circuit and provides oxidation protection for the bonding pad. This multi-functionality reduces the total number of layers required while achieving both circuit functionality and corrosion protection
2Adaptability or versatility
If LED chips with large light-emitting angles are used, then viewing angle coverage is improved, but light-emitting brightness at front viewing angles decreases
Solution Approach 1:
The solution moves from controlling light emission in the horizontal plane to controlling light reflection in the vertical plane. By placing reflective structures beneath the LED chips, light that would otherwise be emitted at wide angles is reflected upward, converting vertical light distribution into controlled front-facing brightness while preserving wide viewing angle coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, reduces production costs, and improves light-emitting brightness at front viewing angles by preventing oxidation and optimizing light reflection.
Implementation Method 1
a film layer disposed on at least one side of the target drive structure and adjacent to the target drive structure in the drive back plate is an inorganic insulating layer
Implementation Method 2
incorporating a reflective structure to enhance light utilization at front viewing angles
Data Source
AI summary
A drive back plate is provided. The drive back plate includes a base substrate, and a drive circuit and a bonding structure disposed on the base substrate. The drive circuit includes a target drive structure, and a film layer disposed on at least one side of the target drive structure and adjacent to the target drive structure in the drive back plate is an inorganic insulating layer. The bonding structure is disposed on the same layer as the target drive structure, and the material of the bonding structure is the same as the material of the target drive structure.