Display Driving Backplane Layout for High-Yield LED Bonding
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Solution Overview
Problem
Current display technologies face challenges in efficiently manufacturing driving backplanes for Mini LED and Micro LED display apparatuses, particularly in forming conductive patterns that allow for precise electrical connections and insulation between conductive lines and electrodes, which affects the reliability and efficiency of light-emitting devices.
Innovation Solution
A method of manufacturing a driving backplane involves forming a first conductive pattern layer with insulated conductive lines and a second conductive pattern layer with electrode groups, where the electrodes are electrically connected to corresponding conductive lines, using a combination of seed films, insulating layers, electroplating, and planarization processes to ensure precise alignment and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional conductive pattern formation methods are used, then manufacturing process is simpler, but bonding efficiency and electrical connection yield are lower
Solution Approach 1:
The patent applies preliminary action by pre-forming protruding portions on the conductive lines before the bonding process. These protruding portions are created through selective removal of insulating layers, preparing the surface in advance to enhance bonding efficiency and electrical connection yield when light-emitting devices are attached.
Solution Approach 2:
The patent segments the insulating layers selectively to expose protruding portions of conductive lines at specific locations. This segmentation allows different regions of the conductive pattern to have different surface characteristics - some areas with exposed conductive protrusions for bonding, others covered by insulating layers for electrical isolation, thereby improving bonding efficiency without requiring complete process redesign.
2Loss of energy
If conductive lines are made closer to reduce voltage drop, then power transmission efficiency improves, but risk of electrical short circuit between crossing lines increases
Solution Approach 1:
The patent applies local quality by creating protruding portions of conductive lines that extend beyond the insulating layer boundaries at specific locations. This local modification allows conductive lines to be closer together for reduced voltage drop, while the protruding portions provide controlled electrical connection points that prevent unintended short circuits between crossing lines.
Solution Approach 2:
The patent resolves the insulation problem by transitioning from a two-dimensional planar insulation approach to a three-dimensional structure with protruding portions. The protruding portions extend vertically beyond the insulating layer plane, creating controlled electrical contact points that allow close spacing of conductive lines while maintaining electrical isolation through the insulating layer in non-protruding regions.
3Reliability
If complex insulating layer structures are added to prevent short circuits, then electrical insulation reliability improves, but manufacturing complexity and process steps increase
Solution Approach 1:
The patent segments the insulating layers selectively rather than using complex multi-layer insulating structures. By removing insulating layers at specific locations to expose protruding portions of conductive lines, the patent achieves reliable electrical insulation with a simpler structure - insulating layers are present only where needed for isolation, and absent where electrical connection is required.
Solution Approach 2:
The patent extracts or removes portions of insulating layers to create the desired electrical connection structure. Instead of adding complex insulating layers to prevent short circuits, the patent takes out unnecessary insulating material to expose conductive protrusions, achieving both insulation reliability and manufacturing simplicity through selective removal rather than addition.
4Ease of manufacture
If surface flatness is maintained for easier manufacturing, then ease of manufacture improves, but bonding precision and electrical connection quality deteriorate
Solution Approach 1:
The patent applies local quality by creating protruding portions on the conductive line surfaces through selective insulating layer removal. These localized protrusions provide precise bonding surfaces at specific locations while the overall substrate maintains relative flatness for ease of manufacturing. The protruding portions serve as alignment features that improve bonding precision without requiring the entire surface to be highly precision-finished.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the bonding efficiency of light-emitting devices by reducing complexity and improving the yield of electrical connections, leading to more reliable and efficient Mini LED and Micro LED display apparatuses with improved power transmission and reduced voltage drop.
Implementation Method 1
forming a first conductive pattern layer on a base, the first conductive pattern layer including a plurality of first conductive lines; and forming a second conductive pattern layer on a side of the first conductive pattern layer away from the base
Data Source
AI summary
A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.