Display Backplane Side-Binding Layout for Narrow-Bezel Panels

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Solution Overview

Problem

The challenge of reducing the side frame width of display panels, particularly in large-size displays, is exacerbated by the need for metal circuit connections on the top surface of display backplanes, leading to wider splicing gaps and impaired visual experience.

Innovation Solution

A display backplane design with conductor layers on both top and bottom surfaces and binding layers on the side surfaces, allowing electrical connections without top surface metal circuits, and enhancing attachment firmness through encapsulation layer combinations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal circuit connection area is reserved on the top surface of the substrate baseplate, then electrical connection is achieved, but the side frame width increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidside frame width

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent moves the electrical connection path from the top surface (2D plane) to the side surface (3D vertical dimension). The first conductor layer extends from the top surface to the side surface, and the binding layer provides vertical electrical connection through the side surface to the second conductor layer on the bottom surface, eliminating the need for top surface metal circuit connection area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Instead of making electrical connections through the top surface as in conventional designs, the patent inverts the connection approach by using the side surface and bottom surface for conductor layers and binding layers, thereby achieving electrical connection without occupying top surface area.

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If binding layer is only attached to the side surface, then electrical connection is achieved, but attachment firmness is insufficient

Engineering Contradiction:

Improveelectrical connectionVSAvoidattachment firmness

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent merges the binding layer with the encapsulation layer at the upper end. The binding layer extends upward and combines with the encapsulation layer, creating a unified structure that simultaneously provides electrical connection and enhanced mechanical attachment firmness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The binding layer is nested within the encapsulation layer structure. The upper end of the binding layer is embedded in or combined with the encapsulation layer, forming a nested configuration that strengthens the overall attachment.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS20260068392A1Display Panel, Display Backplane and Manufacturing Method of Display Backplane

Publication Date: 2026.03.05 CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD

AI summary

The application relates to a display panel, a display backplane and a manufacturing method of the display backplane. A metal circuit connection area on a top surface of a substrate baseplate configured for electrical connection to the outside serves as a second conductor layer to be transferred to a bottom surface for arrangement, and a driving circuit on the top surface of the substrate is electrically connected to the second conductor layer on the bottom surface through a binding layer on a side surface of the substrate baseplate.