Display Backplane Layout for No-Bezel Signal Routing
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Solution Overview
Problem
Existing display technologies face challenges in achieving full-screen and no-bezel stitching displays due to signal communication issues between the front and back sides of substrates, particularly in glass substrates, leading to non-uniform brightness and electrical interference affecting display quality.
Innovation Solution
A display backplane design with bonding electrodes and connection wires on opposite surfaces of a base, where the orthographic projections of these elements do not overlap with pixel circuits, utilizing vias for connections and incorporating dummy circuits to maintain uniformity, along with specific arrangements of pixel and dummy circuit groups to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are formed in glass substrate to communicate signals between front and back sides, then signal communication is achieved, but flexible display cannot be realized
Solution Approach 1:
The invention segments the substrate into a glass substrate and a separate flexible substrate (polyimide substrate). The glass substrate maintains rigid signal communication through vias, while the flexible substrate provides bendability. This segmentation allows each layer to fulfill its specific function without compromising the other.
Solution Approach 2:
The invention transitions from a single-substrate approach to a multi-layer substrate structure. By adding the flexible polyimide substrate as an additional layer bonded to the glass substrate, the system gains flexibility in the vertical dimension while maintaining the horizontal signal communication pathways through the glass substrate.
2Reliability
If bonding electrodes and connection wires are placed on substrate to enable signal communication, then full-screen display is achieved, but electrical interference and non-uniform brightness occur due to overlap with pixel circuits
Solution Approach 1:
The invention extracts the bonding electrodes and connection wires from the pixel circuit area and relocates them to dedicated regions (bonding regions) at the edges of the display area. This separation removes the source of electrical interference from the pixel circuit region, eliminating the harmful electromagnetic interference while maintaining signal communication functionality.
Solution Approach 2:
The invention introduces an insulating layer as an intermediary between the bonding connection wires and the pixel circuits. This insulating layer acts as a barrier that prevents direct electrical interference while still allowing the bonding connection wires to perform their signal transmission function, thus mediating between the conflicting requirements of signal communication and interference prevention.
3Reliability
If bonding electrodes and connection wires are arranged on substrate, then signal communication is achieved, but display area is reduced due to occupation of space
Solution Approach 1:
The invention employs asymmetric arrangement of bonding electrodes and connection wires, concentrating them in specific bonding regions at the edges rather than distributing them uniformly across the substrate. This asymmetric placement minimizes the space occupied by these components while maintaining their signal communication function, thereby maximizing the display area.
Solution Approach 2:
The invention incorporates bonding electrodes and connection wires in the bonding regions before the pixel circuit fabrication process. By preparing these signal communication pathways in advance in dedicated edge regions, the design prevents them from encroaching on the pixel circuit area, thus preserving maximum display area while ensuring signal communication is already established.
Data Source
AI summary
A display backplane is provided, including a base, wherein pixel circuits, bonding electrodes, and bonding connection wires are on the base; the bonding electrodes are coupled to the bonding connection wires in a one-to-one correspondence; the bonding electrodes and the bonding connection wires are on two opposite surfaces of the base; the pixel circuits and the bonding connection wires are on a same side of the base; one end of each bonding connection wire is coupled to the bonding electrode through the first via in the base; the other end of each of at least some bonding connection wires is coupled to the pixel circuit; and an orthographic projection of at least one of the bonding electrodes and the bonding connection wires on the base is not coincident with an orthographic projection of the pixel circuit on the base.