Display Backplane Thermal Via Structure for Insulated Heat Dissipation
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Solution Overview
Problem
Current display backplanes suffer from poor heat dissipation due to the use of insulating substrates with low heat conductivity, which hinders the effective transfer of heat from light-emitting units to the heat dissipation glue.
Innovation Solution
Incorporating a heat conductive layer on the substrate, a light-emitting layer, and a backplane layer with heat conductive holes that contain heat dissipation columns, allowing for direct contact between the heat conductive layer and the backplane layer, thereby enhancing heat conduction and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating substrate with poor heat conductivity is used in the display backplane, then the substrate provides good electrical insulation, but heat emitted by light-emitting units cannot be effectively conducted to the heat dissipation glue, resulting in poor heat dissipation effect
Solution Approach 1:
The substrate is divided into a first substrate layer and a second substrate layer, with the first layer providing electrical insulation and the second layer providing thermal conduction. This segmentation allows each layer to specialize in its primary function without compromising the other.
Solution Approach 2:
The display backplane uses a composite structure combining an insulating substrate material (such as glass or ceramic) with a heat-conductive substrate material (such as metal). This composite approach enables both electrical insulation and effective heat dissipation to coexist in the same component.
2Strength
If heat dissipation glue is used to bond the substrate to the backplane, then bonding is achieved, but the insulating substrate prevents effective heat transfer from the light-emitting units to the glue
Solution Approach 1:
The substrate structure is segmented into two functional layers: the first substrate layer maintains electrical insulation properties for reliable bonding, while the second substrate layer provides a thermal conduction pathway that directs heat from the light-emitting units to the heat dissipation glue, ensuring both bonding strength and heat transfer efficiency.
Solution Approach 2:
The solution adds a vertical dimension to heat transfer by introducing a dedicated heat-conductive layer that creates a thermal pathway perpendicular to the substrate plane, allowing heat to bypass the insulating properties of the first substrate layer and reach the heat dissipation glue effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the heat dissipation efficiency of the display backplane by facilitating the transfer of heat from the light-emitting units to the backplane through the heat conductive layer and dissipation columns, addressing the limitations of existing technologies.
Implementation Method 1
heat dissipation columns are arranged in the heat conductive holes, and the heat dissipation columns are in contact with the heat conductive layer and the backplane layer, respectively
Data Source
AI summary
The present disclosure provides a display backplane and a display device, the display backplane includes a backplane layer, a substrate layer, a heat conductive layer, a light-emitting layer, and heat conductive holes at least penetrating through the substrate layer, which are stacked and arranged. Heat dissipation columns are arranged in the heat conductive holes, and the heat dissipation columns are in contact with the heat conductive layer.