Display Backplate Connection Structure for Easier Micro-LED Bonding
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Solution Overview
Problem
Current micro-LED display panel manufacturing processes are complex and costly due to the high requirements for alignment precision when bonding micro-LEDs to conical tips, leading to inefficiencies in high-resolution and large-size display panels.
Innovation Solution
A display backplate with connection structures that have a protruding tip portion, allowing for reduced alignment requirements and enabling simultaneous connection of multiple micro-LEDs, simplifying the manufacturing process by using a display backplate with connection structures that have a protruding tip portion, made of conductive materials like copper or aluminum, and an insulating main body portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conical tips are used for bonding micro-LEDs, then connection reliability is improved, but alignment precision requirements increase and manufacturing complexity increases
Solution Approach 1:
The connection structure is divided into multiple sections: a first section with larger area for alignment tolerance, a second section with intermediate area, and a third section (tip) with smaller area for reliable bonding. This segmentation allows each section to fulfill different functions - the first section provides alignment tolerance while the third section ensures connection reliability.
Solution Approach 2:
The connection structure employs a nested configuration where the second section is positioned between the first and third sections, with each section nested within the projection area of the previous section. This nested doll structure creates a progressive transition from larger to smaller areas, enabling both alignment tolerance and reliable bonding.
2Reliability
If conical tips are used for bonding micro-LEDs, then connection reliability is improved, but manufacturing time increases
Solution Approach 1:
The connection structures with their specific geometric configurations are pre-formed on the array substrate before micro-LED bonding. This preliminary action ensures that when micro-LEDs are transferred, they can be bonded simultaneously to multiple connection structures without requiring repeated alignment adjustments, thereby reducing manufacturing time while maintaining reliability.
3Reliability
If conical tips are used for bonding micro-LEDs, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The connection structure utilizes controlled changes in geometric parameters (area, shape) across different sections. The first section has a larger area with specific geometric characteristics, the second section has intermediate parameters, and the third section has smaller area optimized for bonding. These parameter changes enable the structure to achieve reliable connections while maintaining manufacturing feasibility through standardized fabrication processes.
Data Source
AI summary
Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.