Display Bank Structure for Precise Etch Profile and LED Alignment
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Solution Overview
Problem
Current display device manufacturing techniques face challenges in forming banks with desired etch profiles and preventing defects such as short-circuits and alignment issues during the fabrication of subminiature light emitting elements.
Innovation Solution
A method involving the formation of a conductive pattern under the bank using dry-etching, which allows for the creation of a bank with a specific etch profile angle and thickness, preventing damage to lower structures and residue removal, thereby enhancing the alignment and electrical coupling of light emitting elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing techniques are used to form banks, then the fabrication process can be completed, but the desired etch profile and alignment precision cannot be achieved
Solution Approach 1:
A conductive pattern is formed on the first insulating layer before forming the bank. This preliminary conductive pattern serves as a foundation that enables precise etching and alignment of the bank structure, resolving the contradiction by preparing the substrate in advance to achieve the desired etch profile angle and alignment precision.
2Productivity
If light emitting elements are supplied using inkjet scheme, then the elements can be placed on substrate, but mixing between elements in respective emission areas may occur
Solution Approach 1:
The substrate is divided into distinct emission areas separated by banks. Each emission area is clearly defined and isolated from others, preventing mixing of light emitting elements between different emission zones while maintaining efficient inkjet placement capability within each segmented area.
Solution Approach 2:
The bank structure acts as an intermediary barrier between adjacent emission areas. This physical separator prevents cross-contamination of light emitting elements during the inkjet placement process while allowing efficient element distribution within each defined emission area.
3Reliability
If bank thickness is increased to prevent defects, then structural integrity improves, but damage to lower structures and residue formation increase
Solution Approach 1:
The conductive pattern is formed on the first insulating layer before bank formation, creating a protective and guiding layer that enables precise etching. This preliminary structure allows the bank to be formed with optimal thickness that prevents defects without causing damage to lower structures or excessive residue formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reliable alignment and electrical coupling of light emitting elements, reducing defects and improving the efficiency and accuracy of the display device fabrication process.
Implementation Method 1
A method involving the formation of a conductive pattern under the bank using dry-etching, which allows for the creation of a bank with a specific etch profile angle and thickness
Implementation Method 2
the bank may include light shielding material to block light that is incident from the light emitting elements
Data Source
AI summary
A display device may include a pixel circuit layer. A first electrode and a second electrode may be on the pixel circuit layer and spaced from each other. A first insulating layer may be on the pixel circuit layer, the first electrode, and the second electrode. A conductive pattern may be on the first insulating layer and electrically insulated from the first electrode and the second electrode. The bank may be on the conductive pattern. Light emitting elements may be located on the first insulating layer between the first electrode and the second electrode, and electrically coupled to the first electrode and the second electrode.