Display Base Plate Layout That Eliminates LED Bonding Alignment
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Solution Overview
Problem
The existing bonding technology for silicon-based LED microdisplay devices requires high alignment accuracy, making the integration of driving circuits and light-emitting diodes complex and difficult, especially for high PPI microdisplays, due to the need for separate substrates and precise connection processes.
Innovation Solution
The solution involves forming the light-emitting diode and driving circuit on the same substrate, with the light-emitting diode having stacked semiconductor layers and a driving circuit connected to them, eliminating the need for bonding technology and simplifying the integration process by dividing the substrate into light-emitting and non-light-emitting regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding technology is used to integrate driving circuits and light-emitting diodes on separate substrates, then device functionality is achieved, but manufacturing complexity and alignment difficulty increase significantly
Solution Approach 1:
The patent merges the driving circuit and light-emitting diode onto the same substrate, eliminating the need for separate substrates and bonding processes. The driving circuit is directly formed on the substrate in the non-light-emitting region, while the light-emitting diode is formed in the light-emitting region, achieving integration without bonding technology.
Solution Approach 2:
The substrate is segmented into distinct light-emitting and non-light-emitting regions, with each region optimized for its specific function. This segmentation allows the driving circuit and light-emitting diode to coexist on the same substrate without interference, resolving the contradiction between integration and functionality.
2Manufacturing precision
If bonding technology with precise alignment is used, then connection accuracy is improved, but manufacturing time and process difficulty increase
Solution Approach 1:
By combining the driving circuit and light-emitting diode on the same substrate, the patent eliminates the alignment and bonding steps entirely. The direct formation of both components on a single substrate removes the time-consuming precision alignment process while maintaining connection accuracy through direct electrical connection.
3Adaptability or versatility
If separate substrates are used for driving circuits and light-emitting diodes, then functional independence is achieved, but device structure and preparation process become more complex
Solution Approach 1:
The substrate is divided into functionally independent regions: a light-emitting region for the light-emitting diode and a non-light-emitting region for the driving circuit. This segmentation maintains functional independence while achieving structural integration, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity of the preparation process by eliminating the need for precise alignment and bonding, thereby simplifying the production of the display base plate and improving the efficiency of light emission.
Implementation Method 1
the light-emitting diode, including a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are stacked; and the driving circuit, respectively connected with the first semiconductor layer and the second semiconductor layer, and used for driving the light-emitting diode to emit light
Data Source
AI summary
Provided are a display base plate and a preparation method thereof and a display apparatus, belonging to the technical field of display devices. The display base plate comprises a substrate, and a light-emitting diode and a driving circuit which are patterned and arranged on one side of the substrate, and the light-emitting diode comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are stacked; and the driving circuit is respectively connected with the first semiconductor layer and the second semiconductor layer, and is used for driving the light-emitting diode to emit light. By the display base plate and the preparation method thereof and the display apparatus provided by the embodiment of the application, the difficulty of integrating the driving circuit and the light-emitting diode in the display base plate can be reduced, so that a preparation process of the display base plate is simpler.