Bending Protection Layer for Display Device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in preventing the separation of driving circuit chips and flexible printed circuit boards during the bending process, which can lead to damage and increased manufacturing costs.
Innovation Solution
A display device design that includes a bending protection layer with a pre-formed and post-formed layer, where the pre-formed layer covers the flexible printed circuit board and the post-formed layer covers the bending area, including the driving circuit chip, to manage stress and prevent separation, using different materials and curing processes for the layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display device is bent to improve visibility and reduce non-display area, then the visibility from various angles is improved and non-display area is decreased, but the driving circuit chip and flexible printed circuit board may separate during the bending process
Solution Approach 1:
The bending protection layer is divided into two separate layers: a pre-formed layer applied before bending and a post-formed layer applied after bending. This segmentation allows each layer to address specific protection needs - the pre-formed layer provides initial protection during the bending process, while the post-formed layer addresses any separation issues that occur after bending, thereby resolving the reliability concern while maintaining the adaptability benefit.
Solution Approach 2:
The pre-formed bending protection layer is applied to the flexible printed circuit board before the bending process occurs. This preliminary action prepares the structure in advance to withstand the stresses of bending, preventing separation of the driving circuit chip and flexible printed circuit board while still allowing the display device to be bent for improved visibility.
2Reliability
If a bending protection layer is added to prevent separation during bending, then the separation of driving circuit chip and flexible printed circuit board is prevented, but the device complexity increases
Solution Approach 1:
The bending protection layers are applied locally only to specific areas where separation is most likely to occur - namely, the flexible printed circuit board and the driving circuit chip region. This localized approach provides necessary protection while minimizing the overall addition to device complexity, as the protection is concentrated where most needed rather than applied uniformly across the entire device.
Solution Approach 2:
The bending protection structure uses composite material composition - the pre-formed layer and post-formed layer can be made from different materials optimized for their specific functions. This composite approach allows each layer to be tailored for its specific protective role, providing effective separation prevention while managing device complexity through material optimization rather than structural complexity.
3Strength
If the pre-formed bending protection layer has greater hardness to protect the flexible printed circuit board, then the protection effectiveness is improved, but the stress management during bending is reduced
Solution Approach 1:
The pre-formed bending protection layer is applied locally to the flexible printed circuit board area where it needs to provide protection during bending. By concentrating the harder protective material only where the flexible printed circuit board requires protection, the design maintains protection effectiveness while managing stress distribution, as the hardness is applied selectively rather than uniformly across all components.
Solution Approach 2:
The pre-formed bending protection layer is applied in advance to the flexible printed circuit board before bending occurs. This preliminary application of the harder protective layer prepares the structure to withstand bending stresses, providing the necessary protection effectiveness while the layer's positioning and material properties are optimized to manage stress distribution during the subsequent bending process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes the separation of driving circuit chips and flexible printed circuit boards during bending, reducing damage and manufacturing costs while maintaining the structural integrity of the display device.
Implementation Method 1
The first pre-formed bending protection layer may include a photo-curable material
Implementation Method 2
The first post-formed bending protection layer may include a thermo-curable material
Data Source
AI summary
A display device and a method of manufacturing a display device are provided. A display device may include: a display panel including a first area, a second area spaced apart from the first area, and a bending area between the first area and the second area; a driving circuit chip on the second area of the display panel; a flexible printed circuit board on the second area of the display panel and spaced apart from the driving circuit chip; and a bending protection layer including a first pre-formed bending protection layer covering a portion of the flexible printed circuit board, and a first post-formed bending protection layer covering the bending area of the display panel.