Display Module Bending Apparatus with Stress Compensation
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Solution Overview
Problem
The stress applied to flexible circuit boards during the bending process can cause damage and improper function, as existing technologies fail to effectively manage and compensate for stress variations in the bending area.
Innovation Solution
A display module bending apparatus and method that includes a stage, a bending arm to fix and bend the circuit board, measuring units to gather information, and a control unit that calculates and compensates the bending path based on measured data to minimize stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a bending process is performed on the flexible circuit board, then the display module can be configured in a flexible form, but the flexible circuit board may be damaged or may not properly function due to stress applied thereto
Solution Approach 1:
The system performs preliminary measurement of the flexible circuit board's properties before bending, and pre-calculates the optimal bending path to minimize stress. The control unit uses the measured information to determine bending parameters in advance, allowing the board to be bent along a predetermined safe path that avoids damage while achieving the desired flexible configuration.
Solution Approach 2:
The measurement unit provides real-time feedback information about the flexible circuit board's state during the bending process. The control unit continuously monitors this feedback and adjusts the bending path and parameters dynamically, ensuring that stress remains within safe limits while achieving the target flexible form. This closed-loop control maintains reliability during the transformation to flexible configuration.
2Productivity
If stress is applied to the flexible circuit board during bending, then the bending process can be completed, but the circuit board may be damaged or may not properly function
Solution Approach 1:
The bending path is made dynamic rather than fixed, allowing real-time adjustments based on measured properties of the flexible circuit board. The control unit dynamically modifies bending parameters such as speed, radius, and path during the process, optimizing the balance between completing the bending operation efficiently and minimizing stress-induced damage to the board.
Solution Approach 2:
The system changes key bending parameters including the bending path, radius, and speed based on measured information from the flexible circuit board. By adjusting these parameters dynamically, the system completes the bending process while maintaining stress levels within safe thresholds, preventing damage to the circuit board.
3Reliability
If the bending path is optimized to reduce stress, then damage to the circuit board is minimized, but additional measurement and calculation steps are required
Solution Approach 1:
The flexible circuit board itself provides the necessary information through the measurement unit, which detects its own properties such as flexibility, thickness, and material characteristics. This self-measured data is then used by the control unit to automatically calculate and adjust the optimal bending path, eliminating the need for external complex measurement systems and reducing overall device complexity while maintaining high reliability.
Data Source
AI summary
A display module bending apparatus includes: a stage on which a display module including a display panel and a circuit board is seated; a bending arm which fixes the circuit board and bending the circuit board based on a first reference; a first measuring unit which measures first information; a second measuring unit disposed on the stage and which measures second information; and a control unit which compensates the first reference based on the first information and the second information.