Flexible Display Bonding With Pneumatic Molding for Bent Substrates

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Solution Overview

Problem

Existing bonding technologies face challenges in securely attaching flexible display devices with bent substrates to a window member, leading to misalignment and defects in the bonding process.

Innovation Solution

A bonding device and method that uses a pad and molding member to bond a display substrate to a window member, where air is introduced through stage openings to expand the molding member, pressing the substrate onto both planar and bending portions of the window member, ensuring secure attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a pad is used to bond the display substrate to the planar portion of the window member, then the bonding of the planar portion is improved, but the bonding of the bending portion is insufficient

Engineering Contradiction:
Improvebonding precisionVSAvoidbonding reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The bonding tool is segmented into two distinct functional components: a pad for bonding the planar portion and a molding member for bonding the bending portion. This segmentation allows each component to be optimized for its specific function, with the pad providing localized pressure for the flat area and the molding member providing conformal pressure for the curved area, thereby resolving the contradiction between bonding precision and bonding reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different bonding mechanisms are applied to different regions of the display substrate based on local geometry requirements. The pad provides concentrated pressure suitable for the planar portion, while the molding member provides distributed conformal pressure suitable for the bending portion. This local differentiation ensures high bonding precision for each region while maintaining overall bonding reliability.

Inventive Principle:
Principle #3Local quality

2Force

If a rigid bonding tool is used, then the bonding pressure is sufficient, but the tool cannot conform to the bending portion of the substrate

Engineering Contradiction:
Improvebonding pressureVSAvoidtool adaptability
Core Design Contradiction:
ForceVSAdaptability or versatility

Solution Approach 1:

The molding member is designed with dynamic characteristics that allow it to deform and conform to the bending portion of the substrate while maintaining sufficient bonding pressure. The member can dynamically adjust its shape to match the substrate geometry, resolving the contradiction between providing adequate force and adapting to complex geometries.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The molding member is constructed as a flexible component that can bend and conform to the curved surfaces of the display substrate's bending portion. This flexibility allows the tool to maintain contact and apply bonding pressure across the entire bending surface, achieving both sufficient force and high adaptability to complex geometries.

Inventive Principle:
Principle #30Flexible shells and thin films

3Manufacturing precision

If air is introduced to expand the molding member, then the bonding of the bending portion is improved, but the process complexity increases

Engineering Contradiction:
Improvebonding precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Air pressure is introduced into the molding member to expand it and improve contact with the bending portion of the substrate. This pneumatic mechanism provides a simple yet effective way to achieve conformal bonding without complex mechanical adjustment systems, resolving the contradiction between bonding precision and process complexity by using a straightforward pneumatic expansion approach.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the bonding process by reducing misalignment and defect rates, providing a reliable and efficient method for attaching flexible display devices with complex geometries to window members.

Implementation Method 1

providing air through a stage opening defined in the stage and disposed adjacent to the pad, to expand a molding member of the bonding device which surrounds the pad

Methodology Applied
Scientific EffectGas pressure expansion: Pressure Increase

Data Source

PatentUS11203175B2Bonding device and method of bonding display device using the same
Publication Date: 2021.12.21 SAMSUNG DISPLAY CO LTD
  • US11203175B2 patent drawing
  • US11203175B2 patent drawing
  • US11203175B2 patent drawing

AI summary

A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.