Display Panel Bonding Layout With Heat-Blocking Board Holes
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Solution Overview
Problem
The existing bonding process for display devices can cause damage to the circuit board components due to heat application, leading to reliability issues during the bonding of the display panel and circuit board.
Innovation Solution
The design includes a circuit board with strategically placed holes adjacent to the connection pads, allowing the conductive adhesion member to extend beyond the substrate pad region, preventing heat transfer to the circuit lines and minimizing damage, while also enabling visual inspection of the adhesion member's position through these holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal pressing tool is used to bond display panel and circuit board, then bonding strength is improved, but heat damage to circuit board components occurs
Solution Approach 1:
The circuit board is segmented by creating holes in specific regions, dividing the board into isolated thermal zones. This segmentation prevents heat from the thermal pressing tool from reaching sensitive circuit components while maintaining bonding strength in the connection pad areas.
Solution Approach 2:
The holes act as thermal barriers or intermediaries between the thermal pressing tool and the circuit board components. By positioning holes between the heat source and sensitive components, they mediate the thermal interaction, allowing bonding to proceed while protecting vulnerable areas from heat damage.
2Object-affected harmful factors
If conductive adhesion member extends beyond substrate pad region, then heat transfer to circuit lines is prevented, but manufacturing complexity increases
Solution Approach 1:
The conductive adhesion member is configured with varying properties in different regions: it extends beyond the substrate pad region in areas where heat blocking is needed, while maintaining standard configuration in bonding areas. This local differentiation prevents heat transfer to circuit lines without unnecessarily complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents damage to the circuit board components during the bonding process, enhances the reliability of the display device, and simplifies the inspection and manufacturing process by allowing visual verification of the adhesion member's correct positioning.
Implementation Method 1
allowing the conductive adhesion member to extend beyond the substrate pad region, preventing heat transfer to the circuit lines
Data Source
AI summary
A display device includes: a display panel including: a base substrate including a display region and a non-display region; a driving chip on the non-display region; and panel pads on the non-display region, and electrically connected to the driving chip; and a circuit board electrically connected to the display panel, and including: an opening overlapping with the driving chip; connection pads located along a first direction, and overlapping with the panel pads; and holes spaced from each other in the first direction, with the connection pads located therebetween.