Display Panel Bonding Channel to Prevent Adhesive Voids
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display panels face reliability issues due to bubbles or holes in the conductive adhesive layer during bonding, affecting the electrical connection between the display panel and the chip, which compromises the sealing and performance of the panel.
Innovation Solution
A display panel design featuring an insulating layer with an accommodation groove and a channel that allows gas to be discharged externally, ensuring balanced air pressure and preventing bubbles or holes in the conductive adhesive layer, thereby enhancing the reliability of the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bonding process is used to realize electrical connection between the display panel and chip through a conductive adhesive layer, then electrical connection is achieved, but bubbles or holes form in the conductive adhesive layer affecting reliability
Solution Approach 1:
The patent extracts the harmful gas from the bonding interface by providing a discharge channel that extends from the accommodation groove through the insulating layer to the external environment. This allows gas to be removed from the bonding area during the bonding process, preventing bubble and hole formation in the conductive adhesive layer while maintaining electrical connection reliability
Solution Approach 2:
The patent introduces a gas discharge channel as an intermediary pathway between the accommodation groove and the external environment. This channel serves as a mediator that allows gas to escape during bonding without directly affecting the conductive adhesive layer, thereby eliminating bubbles and holes while preserving the electrical connection function
2Reliability
If the conductive adhesive layer is applied to cover the accommodation groove, then electrical connection is established, but air pressure imbalance causes bubbles or holes
Solution Approach 1:
The patent extracts excess gas from the accommodation groove through the discharge channel during the bonding process. This continuous gas removal maintains air pressure balance between the interior of the accommodation groove and the external environment, preventing bubble and hole formation in the conductive adhesive layer while ensuring reliable electrical connection
Solution Approach 2:
The patent incorporates the discharge channel structure into the insulating layer before the bonding process begins. This preliminary preparation of the gas escape pathway ensures that air pressure can be balanced during bonding, preventing defects in the conductive adhesive layer and establishing reliable electrical connection from the outset
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents bubbles and holes in the conductive adhesive layer, improving the reliability and meeting customer specifications by maintaining a balance of air pressure and ensuring a stable electrical connection between the chip and the first electrodes.
Implementation Method 1
A channel is provided in the insulating layer for the accommodation groove to communicate with outside
Data Source
AI summary
A display panel includes a substrate, an insulating layer arranged at one side of the substrate, a conductive adhesive layer arranged at one side of the insulating layer away from the substrate, and a chip arranged at one side of the conductive adhesive layer away from the substrate. The insulating layer is provided with an accommodation groove, and first electrodes are arranged within the accommodation groove. Along a direction perpendicular to a plane where the substrate is located, an orthographic projection of the conductive adhesive layer on the substrate covers an orthographic projection of the accommodation groove on the substrate. Part of the conductive adhesive layer is in contact with the first electrodes, and the chip is in contact with the conductive adhesive layer. A channel is provided in the insulating layer for the accommodation groove to communicate with outside.