Display Component Bonding With Cooled Adhesive Modulus Control

Solution Overview

Problem

Existing display device manufacturing processes face challenges in ensuring high-quality bonding of components using adhesives, leading to defects such as waviness and step differences due to inadequate control of adhesive modulus during the bonding process.

Innovation Solution

A manufacturing device and method that utilizes cooling air with a temperature range of 0 to 25 degrees Celsius to increase the modulus of pressure-sensitive adhesives, combined with precise pressure application, to enhance bonding quality by preventing defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If adhesive bonding is performed at room temperature, then bonding process is simple and fast, but adhesive modulus is low causing waviness and step differences

Engineering Contradiction:

Improvebonding qualityVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the temperature parameter of the adhesive during bonding. By cooling the adhesive to a specific temperature range (5-18°C), the modulus of the adhesive increases, which prevents waviness and step differences during the bonding process, thereby improving bonding quality without adding complex device structures

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies cooling air to the adhesive before the bonding process begins. This preliminary cooling action increases the adhesive modulus in advance, ensuring that the adhesive maintains appropriate stiffness during bonding, which prevents defects like waviness and step differences

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If adhesive modulus is increased to prevent waviness, then bonding quality improves, but adhesive becomes too rigid causing bonding defects

Engineering Contradiction:

Improvesurface smoothnessVSAvoidbonding reliability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent precisely controls the temperature parameter within a specific range (5-18°C) to optimize the adhesive modulus. This controlled parameter change increases the modulus enough to prevent waviness while maintaining the adhesive's bonding capability, avoiding the pitfall of making the adhesive too rigid

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs temperature sensing to monitor the adhesive temperature during the bonding process. This feedback mechanism ensures that the adhesive remains within the optimal temperature range, allowing real-time adjustment to maintain both surface smoothness and bonding reliability

Inventive Principle:

Principle #23Feedback

3Manufacturing precision

If cooling air is supplied to increase adhesive modulus, then bonding quality improves, but process time increases

Engineering Contradiction:

Improveadhesive bonding qualityVSAvoidbonding process time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent applies cooling air to the adhesive before the bonding process begins. This preliminary cooling action increases the adhesive modulus in advance, ensuring that the adhesive maintains appropriate stiffness during bonding, which prevents defects like waviness and step differences

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the temperature parameter of the adhesive during bonding. By cooling the adhesive to a specific temperature range (5-18°C), the modulus of the adhesive increases, which prevents waviness and step differences during the bonding process, thereby improving bonding quality without adding complex device structures

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively prevents defects in adhesive bonding, reducing waviness and ensuring smooth, defect-free integration of display device components, thereby improving display quality.

Implementation Method 1

supplying cooling air having a temperature in a range from about 0 degrees to about room temperature, which is about 25 degrees, to the object to be processed... the temperature of the cooling air may be a temperature which increases a modulus of the adhesive

Methodology Applied

Scientific EffectTemperature-dependent modulus change:

Implementation Method 2

the air blowing device may include a vortex tube, and the vortex tube may include an inlet through which compressed air is supplied, a first outlet through which high-temperature air heated by the supply of the compressed air is discharged, and a second outlet through which cooling air cooled down by the supply of the compressed air is discharged

Methodology Applied

Scientific EffectVortex tube effect: Ranque-Hilsch Effect

Data Source

PatentUS20260047274A1Manufacturing device for display device and manufacturing method of display device using the same

Publication Date: 2026.02.12 SAMSUNG DISPLAY CO LTD

AI summary

A manufacturing device for a display device includes a stage on which an object to be processed is disposed, an air blowing device supplying cooling air having a temperature in a range from about 0 degrees to about room temperature, which is about 25 degrees, to the object to be processed, and a pusher applying a pressure on an adhesive. The object to be processed may include an electronic component including a first surface and a second surface opposite to the first surface in a direction, and the adhesive disposed on the second surface of the electronic component.