Display Panel Bonding Layer for Self-Aligned LED Transfer
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Solution Overview
Problem
The current transfer accuracy of light-emitting elements in display panel manufacturing is low, affecting the yield of the display panel due to alignment deviations and inefficiencies in mass transfer technologies.
Innovation Solution
A method involving a backplate with specific regions and an auxiliary layer, where light-emitting elements are aligned using the surface tension of a fluid first part to form a eutectic bonding layer, improving self-alignment and transfer accuracy by varying the fluidity of different parts of the auxiliary layer under controlled conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mass transfer technology is used to transfer light-emitting elements to backplate, then transfer efficiency is improved, but transfer accuracy deteriorates due to alignment deviations
Solution Approach 1:
The patent introduces an auxiliary layer as an intermediary between the light-emitting elements and the backplate. This auxiliary layer includes a fluid part that can flow to fill gaps and enable self-alignment of the light-emitting elements, thereby maintaining high transfer efficiency while significantly improving transfer accuracy by eliminating alignment deviations
Solution Approach 2:
The patent changes the physical state parameter of the auxiliary layer material from solid to fluid during the transfer process. By controlling the temperature to maintain the auxiliary layer in a fluid state during transfer, the material can flow and adapt to fill gaps, enabling both efficient mass transfer and precise self-alignment of light-emitting elements
2Device complexity
If conventional bonding method is used without auxiliary layer, then process complexity is reduced, but bonding reliability deteriorates due to poor alignment
Solution Approach 1:
The auxiliary layer acts as a mediator that facilitates reliable bonding by enabling self-alignment through fluid flow. The fluid part of the auxiliary layer fills gaps and allows light-emitting elements to self-align with bonding parts, significantly improving bonding reliability without requiring complex alignment mechanisms
Solution Approach 2:
The patent employs self-service principle where the fluid auxiliary layer automatically performs the alignment function through its flow characteristics. The material self-adjusts to fill gaps and enable proper positioning of light-emitting elements, eliminating the need for external alignment mechanisms and maintaining process simplicity while improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the transfer accuracy and efficiency of light-emitting elements, reducing alignment errors and improving the overall yield of the display panel manufacturing process.
Implementation Method 1
aligned using the surface tension of a fluid first part to form a eutectic bonding layer
Implementation Method 2
bonding the electrodes of the plurality of light-emitting elements and the plurality of bonding parts to form an eutectic bonding layer
Data Source
AI summary
A method for manufacturing a display panel includes providing a backplate, forming bonding parts on backplate, forming an auxiliary layer on backplate, releasing light-emitting elements onto the auxiliary layer such that electrodes of the light-emitting elements are in contact with the first parts to form an intermediate backplate, arranging the intermediate backplate under first predetermined condition under which a fluidity of the first part is greater than that of the second part, and bonding the electrodes and the bonding parts to form an eutectic bonding layer, and arranging the intermediate backplate under second predetermined condition such that the first and second parts form solid-state first and second members. The backplate includes first and second regions. The bonding parts are located in the first regions. The auxiliary layer covers the backplate and the bonding parts. The auxiliary layer includes first and second parts respectively located in the first and second regions.