Display Bonding Using Stacked Securing Mechanisms
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Solution Overview
Problem
Traditional methods for securing displays to computing devices require a large 'deadband' area, which is inactive and reduces the active image area, leading to a less optimal viewing experience.
Innovation Solution
The implementation of stacked securing mechanisms, which include a combination of adhesive and fastening assemblies positioned vertically underneath the display protective layer, reducing the deadband by securing the display to the chassis with a narrower inactive border, thereby increasing the active image area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If traditional bonding methods are used to secure the display to the chassis, then the display is reliably attached, but a large deadband area is required which reduces the active image area
Solution Approach 1:
The patent transitions from planar bonding to three-dimensional stacked bonding by positioning bonding interfaces at multiple vertical levels (first bonding interface between display and intermediate layer, second bonding interface between intermediate layer and chassis). This vertical stacking allows secure attachment with minimal horizontal deadband, thereby maximizing the active image area while maintaining attachment reliability.
2Reliability
If a large deadband is used to secure the display, then the display attachment is reliable, but the active image area is reduced
Solution Approach 1:
By moving the bonding function from a single large planar interface to multiple stacked interfaces distributed vertically, the patent achieves reliable attachment without requiring extensive horizontal bonding area. This eliminates the need for large deadband while maintaining secure display attachment to the chassis.
3Area of moving object
If stacked securing mechanisms are used, then the deadband is reduced and active image area is increased, but the device complexity increases
Solution Approach 1:
The patent combines multiple functions into the intermediate layer component, which serves as both a structural element for stacking and a bonding surface for both the display and chassis. This integration reduces the number of separate components needed, thereby managing device complexity while achieving reduced deadband through stacked bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the user experience by providing a more extensive active display area with reduced deadband, allowing for a 'side to side' and 'wall to wall' image presentation across the display, while also facilitating easier assembly and disassembly without damaging the device.
Implementation Method 1
securing a display to a chassis of a device
Data Source
Figure 1~2
Figure 3
Figure 4A~4B
AI summary
The description relates to display devices. One example can include a display having an active area surrounded by an inactive deadband. The example can also include a chassis, the display received in the chassis and secured to the chassis beneath the inactive deadband with adhesive. The example can further include a fastening assembly positioned below the inactive deadband and farther beneath the plane than the adhesive, where the fastening assembly creates a retention force between the display and the chassis.