Display Panel Bonding Region Layout for Step Difference Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The FMLOC technology in AMOLED display panels experiences peeling and touch failure due to a large step difference at the boundary of the OC planarization layer during bonding with an FPC, leading to disconnection of the touch panel.
Innovation Solution
A display panel design with a first conductive pattern having distinct portions and a first insulating layer that exposes one portion and penetrates the other, reducing the step difference and minimizing peeling and corrosion risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the OC planarization layer boundary is positioned at the bonding region, then the bonding area is maximized, but a large step difference occurs causing peeling and disconnection
Solution Approach 1:
The first conductive pattern is divided into two portions: a first portion that extends to the boundary of the first insulating layer and a second portion that is covered by the first insulating layer. This segmentation allows the bonding area to be maximized while the insulating layer protects the conductive pattern from peeling, thus resolving the contradiction between bonding area and connection stability.
2Object-affected harmful factors
If the first insulating layer completely covers the first conductive pattern, then the conductive pattern is protected from corrosion, but the bonding area is reduced
Solution Approach 1:
The first insulating layer is configured to expose the first portion of the first conductive pattern while covering the second portion. This local differentiation allows the insulating layer to provide corrosion protection where needed (covering the second portion) while maintaining bonding area (exposing the first portion), thus resolving the contradiction between corrosion protection and bonding area.
3Ease of manufacture
If the step difference at the insulating layer boundary is large, then the manufacturing process is simplified, but peeling occurs during bonding
Solution Approach 1:
The first insulating layer acts as an intermediary between the substrate and the external environment. By strategically exposing the first portion and covering the second portion, it mediates between the need for simple manufacturing (maintaining step difference) and the need for strong adhesion (preventing peeling), thus resolving the contradiction between manufacturing simplicity and adhesion strength.
Data Source
AI summary
The present disclosure provides a display panel and a display device. The display panel includes: a functional circuit region and a bonding region on a side of the functional circuit region; wherein the bonding region includes a substrate, a first conductive pattern on a first surface of the substrate, and a first insulating layer; wherein the first conductive pattern includes a first portion and a second portion; the distance between the top surface of the first portion and the first surface is greater than the distance between the top surface of the second portion and the first surface; the first insulating layer exposes the first portion and a boundary of the first insulating layer penetrates the second portion.