Display Panel Bonding Test Layout Using PCB Measurement Terminals
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Solution Overview
Problem
Conventional display apparatuses struggle to efficiently test the bonding quality between a flexible printed circuit board and a display panel, as well as between an integrated circuit chip and the display panel, which affects the accurate transmission of electrical signals due to decreasing pad sizes and pitches with increased resolution.
Innovation Solution
The display apparatus includes a measurement terminal unit with adjacent measurement terminals connected to specific PCB output pads, allowing for resistance measurement between IC and PCB pads, facilitating easy checking of bonding states.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pad size and pitch are decreased to increase display resolution, then display resolution is improved, but bonding quality testing becomes more difficult
Solution Approach 1:
The patent divides the bonding quality testing into separate measurement processes: first measuring the bonding state between the flexible printed circuit board and display panel, then measuring the bonding state between the integrated circuit chip and display panel. This segmentation allows each bonding interface to be tested independently using dedicated measurement terminals and procedures, making the detection of bonding quality issues more feasible even with decreased pad sizes and pitches
Solution Approach 2:
The patent introduces measurement terminals as intermediary elements that facilitate the bonding quality measurement process. These measurement terminals are specifically designed to access and measure the bonding states at the pad interfaces without requiring direct manipulation of the small pads themselves, thereby simplifying the detection process while maintaining measurement accuracy
2Measurement precision
If pad size is decreased to maintain high resolution, then display resolution is improved, but bonding strength becomes more critical and harder to ensure
Solution Approach 1:
The patent performs bonding quality measurement during the manufacturing process before the display panel is assembled into the final product. By measuring the bonding states of both the flexible printed circuit board and integrated circuit chip to the display panel during manufacturing, potential bonding strength issues can be detected and addressed before assembly, ensuring reliable connections even with small pads
3Measurement precision
If multiple bonding interfaces are tested separately, then bonding quality measurement accuracy is improved, but testing complexity increases
Solution Approach 1:
The patent segments the testing process into distinct measurement phases: first testing the bonding state between the flexible printed circuit board and display panel using measurement terminals connected to PCB output pads, then testing the bonding state between the integrated circuit chip and display panel using measurement terminals connected to IC output pads. This segmentation enables accurate measurement of each bonding interface while organizing the complexity into manageable steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient testing of bonding quality, ensuring reliable electrical signal transmission by identifying and addressing potential connection issues between the flexible printed circuit board, integrated circuit chip, and display panel.
Implementation Method 1
the measurement terminal unit measures connection resistance between the IC input pads and the IC output pads
Implementation Method 2
a first anisotropic conductive film, having a first thickness, is disposed between the IC output pads and the PCB output pads, and a second anisotropic conductive film, having a second thickness, is disposed between the IC input pads and the PCB input pads
Data Source
AI summary
A display apparatus includes a display panel including a plurality of printed circuit board (PCB) input pad units and a plurality of integrated circuit (IC) input pad units, a printed circuit board including a plurality of PCB output pad units and a measurement terminal unit, and a plurality of integrated circuit chips respectively connected to the plurality of IC input pad units. The measurement terminal unit includes a plurality of measurement terminals arranged adjacent to each other. Each of the plurality of integrated circuit chips includes a plurality of IC output pads. Each of the plurality of PCB output pad units includes a plurality of PCB output pads electrically connected to the plurality of IC output pads. At least some of the plurality of PCB output pads electrically connected to the plurality of IC output pads are electrically connected to the plurality of measurement terminals.