Display Panel Bonding Structure With UV-Curing Access Holes
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Solution Overview
Problem
Current display device manufacturing methods face inefficiencies in curing fillers between electronic components and display panels, particularly in ensuring effective conductivity and reducing process complexity.
Innovation Solution
The use of an ultrasonic bonding method to connect electronic components to display panels, with strategically placed holes in the components to allow external ultraviolet light to cure fillers, enhancing curing efficiency and reducing process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ultrasonic bonding method is used to connect electronic components to display panels, then conductivity and connection strength are improved, but the curing efficiency of filler remains insufficient due to blocked UV light access
Solution Approach 1:
The electronic component is segmented by forming holes through its body, dividing the structure into regions that allow UV light to reach the filler. This segmentation enables simultaneous achievement of strong ultrasonic bonding and effective filler curing by creating light transmission pathways without compromising the bonding interface.
Solution Approach 2:
The holes are strategically positioned in specific regions of the electronic component where they do not interfere with the bonding area but provide localized UV light transmission. This local modification allows the filler in those specific regions to be cured effectively while maintaining overall connection strength.
2Ease of manufacture
If traditional bonding methods are used without holes, then manufacturing process is simpler, but filler curing is incomplete and conductivity is reduced
Solution Approach 1:
The electronic component structure is modified by adding holes, which segments the otherwise solid structure. This segmentation enables UV light to penetrate through the component and cure the filler completely, improving reliability without significantly complicating the manufacturing process.
Solution Approach 2:
The electronic component is designed with a porous structure (holes) that allows UV light transmission. This porous design enables complete filler curing while maintaining the structural integrity and electrical functionality of the component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the curing efficiency of fillers between the electronic components and display panels, leading to enhanced connectivity and reduced complexity in the manufacturing process.
Implementation Method 1
The plurality of driving bumps are respectively connected to the plurality of signal pads
Implementation Method 2
external ultraviolet light is transmitted to the filler through the hole
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A display device includes a display panel including a display area and a non-display area defined therein and including a plurality of signal pads overlapping the non-display area, an electronic component including a base layer with an upper surface and a lower surface, a plurality of driving pads disposed on the lower surface of the base layer, and a plurality of driving bumps respectively disposed on the plurality of driving pads, the plurality of driving bumps being respectively connected to the signal pads, and a filler disposed between the display panel and the electronic component. A first hole is defined in the upper surface of the base layer, and the first hole does not overlap the plurality of driving bumps in a plan view.