Bridge FPC Touch Interconnect for Low-Interference Display Panels

The patent divides the FPC into multiple layers (first FPC layer, second FPC layer, third FPC layer) with each layer containing specific connection components. The bonding pins are segmented and distributed across different layers and regions (first soldering region, second soldering region, third soldering region), allowing complex connections to be broken down into manageable segments that reduce overall device complexity while maintaining reliability.

The patent utilizes the thickness dimension of the FPC by implementing bonding pins across multiple layers (first, second, and third FPC layers). This vertical distribution of connection elements allows high-density connections without increasing the horizontal footprint, effectively resolving the contradiction between connection reliability and device complexity through spatial optimization.

The bonding pins are segmented and assigned to specific functional regions: first bonding pins in the first soldering region for display panel connections, second bonding pins in the second soldering region for touch panel connections, and third bonding pins in the third soldering region for additional functions. This segmentation allows each region to be manufactured and tested independently, reducing overall manufacturing precision requirements while maintaining high signal transmission efficiency.

The patent introduces a flexible printed circuit board as an intermediary element that provides mechanical support and electrical connection pathways. The FPC substrate acts as a mediator that accommodates the bonding pins and provides routing paths, reducing the direct precision requirements between display panel and touch panel components while ensuring reliable signal transmission.

The patent applies local quality by implementing shielding structures specifically in regions where signal interference is most likely to occur. The fourth bonding pins are positioned to provide shielding for the third soldering region, and additional shielding structures are placed near high-frequency signal pathways. This localized approach to interference mitigation maintains manufacturing simplicity while effectively reducing signal interference in critical areas.

The FPC substrate and its associated bonding pins serve as intermediary shielding elements between different signal pathways. The layered structure of the FPC with distributed bonding pins creates natural shielding zones that reduce electromagnetic interference without requiring complex additional components, thus maintaining ease of manufacture while protecting against signal interference.