Display Module Buffer Part Reduces Flexible Circuit Wear
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Solution Overview
Problem
The constant friction between a flexible circuit board and a substrate causes wear, reducing the yield of liquid crystal display panels when the flexible circuit board is bent.
Innovation Solution
A buffer part is disposed between the flexible circuit board and the substrate's soldering portion to reduce friction, comprising materials like polyimide or acrylic organic photoresist and potentially thermally conductive particles, which helps in preventing wear and improving product yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible circuit board is bent to connect the driving chip and printed circuit board, then electrical connection is achieved, but friction between the flexible circuit board and substrate causes wear and reduces product yield
Solution Approach 1:
A buffer part made of soft material (such as acrylic organic photoresist or polyimide) is introduced between the flexible circuit board and the substrate. This intermediary layer absorbs the friction and mechanical stress during bending, preventing direct contact and wear between the flexible circuit board and substrate, thereby improving product yield while maintaining electrical connection functionality
2Ease of operation
If the flexible circuit board is bent from the first surface to the second surface of the soldering portion, then connection between driving chip and printed circuit board is established, but constant friction occurs during bending
Solution Approach 1:
The buffer part is pre-installed on the substrate before the flexible circuit board is bent and connected. This beforehand cushioning protects the flexible circuit board from friction and wear during the bending operation and throughout its service life, extending its durability while enabling the necessary electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer part effectively reduces friction and prevents wear of the flexible circuit board, thereby enhancing the product yield and stability of the display module.
Implementation Method 1
A buffer part is disposed between the flexible circuit board and the substrate's soldering portion to reduce friction, comprising materials like polyimide or acrylic organic photoresist
Data Source
AI summary
A display module and an electronic device are provided. The display module includes a substrate, a display part, a driving chip, a flexible circuit, and a buffer part. The substrate includes a soldering portion. The display part is disposed on a light emitting side of the substrate. The driving chip is disposed on a light emitting side of the soldering portion. The flexible circuit board is bent from a first surface of the soldering portion to a second surface of the soldering portion. The buffer part is disposed between the flexible circuit board and the soldering portion.