Display and Camera Window Assembly With Low-Stress Epoxy Sealing
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Solution Overview
Problem
Existing electronic devices face challenges in securely mounting displays and cameras while minimizing damage from high stress conditions and ensuring effective sealing against moisture ingress, particularly when using low-temperature and low-pressure polymer molding processes.
Innovation Solution
The use of a thermoset polymer, such as epoxy, is employed to form seals, encapsulants, and support structures within the device, utilizing low-temperature and low-pressure molding to avoid damage to sensitive components and incorporating a photoinitiator for UV-sensitive curing to ensure complete polymer bonding, along with chemical bonds to glass and metal parts for enhanced sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional high-temperature and high-pressure molding processes are used to form seals and encapsulants, then complete polymer bonding and sealing is achieved, but sensitive components such as displays and cameras are damaged
Solution Approach 1:
The patent changes the temperature and pressure parameters of the molding process from traditional high-temperature/high-pressure conditions to low-temperature/low-pressure conditions. This is achieved by using thermoset polymers with specific curing characteristics that allow complete bonding and sealing at reduced thermal and mechanical stress, thereby protecting sensitive components while maintaining sealing effectiveness
Solution Approach 2:
The patent replaces the traditional mechanical/thermal molding system with a chemical curing system. Thermoset polymers are used that cure through chemical reactions (such as UV-curable polymers or two-part epoxy systems) rather than relying solely on heat and pressure, enabling complete polymer bonding without subjecting components to damaging mechanical stresses
2Object-affected harmful factors
If low-temperature and low-pressure polymer molding is used to protect components, then component damage is minimized, but complete polymer bonding and sealing may be compromised
Solution Approach 1:
The patent substitutes mechanical bonding mechanisms with chemical bonding mechanisms. Thermoset polymers form cross-linked molecular structures through chemical curing reactions, creating strong, permanent bonds that achieve complete sealing effectiveness without relying on high mechanical pressure or thermal energy that could damage components
Solution Approach 2:
The patent employs composite material systems combining thermoset polymers with specific additives and formulations. These composite polymer systems are designed to cure completely at low temperatures through chemical reactions, achieving both component protection and reliable sealing by integrating multiple functional materials that work synergistically
3Reliability
If additional coatings are applied to enhance sealing, then moisture-tight sealing is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent makes the polymer molding material multi-functional by formulating thermoset polymers that simultaneously provide structural support, sealing, encapsulation, and adhesive bonding properties. This eliminates the need for separate protective coatings and sealing layers, reducing device complexity while maintaining moisture-tight sealing effectiveness
Solution Approach 2:
The patent merges multiple functions into a single polymer material system. The thermoset polymer serves as both the structural encapsulant and the moisture sealant, combining what would traditionally require separate coatings and sealing layers into one integrated material that performs multiple protective functions simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively supports and protects display components, prevents damage during stress events, and forms moisture-tight seals without additional coatings, while allowing for efficient integration of camera windows and printed circuit boards.
Implementation Method 1
incorporating a photoinitiator for UV-sensitive curing to ensure complete polymer bonding
Implementation Method 2
chemical bonds to glass and metal parts for enhanced sealing
Data Source
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AI summary
Electronic devices (10) may be provided with components such as displays (14) and cameras. A display (14) may be mounted in a housing (12). The housing (12) may have a sidewall (12W). A bent portion of the display (14) may be embedded in epoxy (20) that is separated from the sidewall (12W) by an air gap (22). Adhesive (24) may attach the epoxy to the housing. A metal support (26) that is chemically bonded to the epoxy (20) may be welded to metal structures such as camera brackets and other metal supports. The housing (12) may have a glass layer that forms a rear wall (12R). The glass layer may have a protruding portion (12RP) that forms a glass plateau with openings through which cameras operate. A camera (54) may have a protruding portion that is received within one of the glass plateau openings. The protruding portion (12RP) may extend into a metal camera trim (52) in one of the openings that is attached to the glass plateau.